• Source: Scopus
  • Calculated based on no. of publications stored in Pure and citations from Scopus
19972021

Research activity per year

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  • 2017

    SiGe HBT technology and circuits for THz applications

    Rieh, J-S., 2017 Jan 1, HighSpeed Devices and Circuits with THz Applications. CRC Press, p. 67-91 25 p.

    Research output: Chapter in Book/Report/Conference proceedingChapter

  • 2012

    Recent advances in solid-state electronic terahertz systems

    Rieh, J. S., Kim, D. H., Kim, K. & Kim, H., 2012 Jan 1, Convergence of Terahertz Sciences in Biomedical Systems. Springer Netherlands, p. 129-146 18 p.

    Research output: Chapter in Book/Report/Conference proceedingChapter

    1 Citation (Scopus)
  • 2011

    SiGe/Si Heterojunction Bipolar Transistors and Circuits

    Rieh, J-S., 2011 Jan 1, Comprehensive Semiconductor Science and Technology. Elsevier Inc., Vol. 1-6. p. 1-51 51 p.

    Research output: Chapter in Book/Report/Conference proceedingChapter

  • 2007

    Self-heating and thermal effects

    Rieh, J-S., 2007 Jan 1, Silicon Heterostructure Devices. CRC Press, p. 14-1-14-13

    Research output: Chapter in Book/Report/Conference proceedingChapter

  • SiGe HBT performance limits

    Freeman, G., Stricker, A., Greenberg, D. R. & Rieh, J-S., 2007 Jan 1, Silicon Heterostructure Devices. CRC Press, p. 16-1-16-12

    Research output: Chapter in Book/Report/Conference proceedingChapter

  • 2005

    Self-heating and thermal effects

    Rieh, J-S., 2005 Jan 1, Silicon Heterostructure Handbook: Materials, Fabrication, Devices, Circuits and Applications of SiGe and Si Strained-Layer Epitaxy. CRC Press, p. 4.12-539-4.12-552

    Research output: Chapter in Book/Report/Conference proceedingChapter

  • SiGe HBT performance limits

    Freeman, G., Stricker, A., Greenberg, D. R. & Rieh, J-S., 2005 Jan 1, Silicon Heterostructure Handbook: Materials, Fabrication, Devices, Circuits and Applications of SiGe and Si Strained-Layer Epitaxy. CRC Press, p. 4.14-571-4.14-582

    Research output: Chapter in Book/Report/Conference proceedingChapter