• 5793 Citations
  • 38 h-Index
19952019

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2007

A novel low-temperature microcap packaging using SU-8 bonding

Kim, Y. K., Yi, S. H., Kim, S. W. & Ju, B. K., 2007, TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems. p. 2107-2110 4 p. 4300581. (TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)