Engineering & Materials Science
Microprocessor chips
76%
Data storage equipment
68%
Electric power utilization
66%
Program processors
62%
Energy utilization
61%
Temperature control
56%
Graphics processing unit
52%
Temperature
51%
Static random access storage
41%
Hot Temperature
38%
Mobile computing
37%
Dynamic frequency scaling
36%
Voltage scaling
35%
Particle accelerators
34%
Smartphones
29%
Energy efficiency
29%
Electric potential
25%
Scheduling
24%
Cooling
24%
Heat problems
23%
Dynamic random access storage
23%
Simulators
18%
Power management
17%
Governors
16%
Servers
16%
Embedded systems
16%
Flash memory
16%
Clocks
14%
Computer hardware
14%
Virtual machine
13%
Costs
13%
Degradation
12%
Display devices
11%
Cache memory
11%
Multimedia systems
11%
Sensors
11%
Ontology
11%
Wire
10%
Heat resistance
10%
Liquids
10%
Heat sinks
10%
Green computing
10%
System-on-chip
9%
RRAM
9%
Leakage (fluid)
9%
Mobile cloud computing
9%
Scalability
9%
Digital forensics
8%
Silicon
8%
Temperature measurement
8%
Mathematics
Cache
100%
Performance
44%
Embedded Processor
42%
Process Variation
42%
Thermal Management
40%
Microprocessor
36%
Voltage
31%
Architecture
30%
Energy
29%
Mobile Devices
29%
Leakage
28%
Energy Consumption
27%
High Performance
24%
Multi-core Processor
23%
Scaling
23%
Energy Efficient
23%
Power Consumption
22%
Energy Efficiency
22%
Soft Error
20%
Scheduler
18%
Latency
16%
Buffer
16%
Predictors
16%
Simulation
15%
Branch
15%
Simulator
14%
Policy
13%
Multimedia Applications
12%
Energy Management
12%
Prediction
11%
Percent
11%
Design
11%
Target
11%
Graphics Processing Unit
11%
Operating Systems
9%
Replacement Policy
9%
Random Access
9%
Accelerator
9%
Unit
9%
Boosting
9%
Demand
8%
Software
8%
Modeling
8%
Performance Analysis
8%
Die
8%
Sensor
7%
Cycle
7%
Preprocessing
7%
Minimise
7%
3D
7%
