2D Single-Crystalline Copper Nanoplates as a Conductive Filler for Electronic Ink Applications

Jin Won Lee, Jiyoon Han, Dong Su Lee, Sukang Bae, Sang Hyun Lee, Seoung Ki Lee, Byung Joon Moon, Chel Jong Choi, Gunuk Wang, Tae Wook Kim

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

Large-scale 2D single-crystalline copper nanoplates (Cu NPLs) are synthesized by a simple hydrothermal method. The combination of a mild reductant, stabilizer, and shape modifier allows the dimensional control of the Cu nanocrystals from 1D nanowires (NWs) to 2D nanoplates. High-resolution transmission electron microscopy (HR-TEM) reveals that the prepared Cu NPLs have a single-crystalline structure. From the X-ray photoelectron spectroscopy (XPS) analysis, it is found that iodine plays an important role in the modification of the copper nanocrystals through the formation of an adlayer on the basal plane of the nanoplates. Cu NPLs with an average edge length of 10 μm are successfully synthesized, and these Cu NPLs are the largest copper 2D crystals synthesized by a solution-based process so far. The application of the metallic 2D crystals as a semitransparent electrode proves their feasibility as a conductive filler, exhibiting very low sheet resistance (0.4 Ω ▫−1) compared to Cu NWs and a transmittance near 75%. The efficient charge transport is due to the increased contact area between each Cu NPL, i.e., so-called plane contact (2D electrical contact). In addition, this type of contact enhances the current-carrying capability of the Cu NPL electrodes, implying that the large-size Cu NPLs are promising conductive fillers for printable electrode applications.

Original languageEnglish
Article number1703312
JournalSmall
Volume14
Issue number8
DOIs
Publication statusPublished - 2018 Feb 22

Fingerprint

Ink
Nanowires
Fillers
Copper
Electrodes
Crystalline materials
Nanoparticles
Nanocrystals
Photoelectron Spectroscopy
Crystals
Sheet resistance
Reducing Agents
High resolution transmission electron microscopy
Iodine
Transmission Electron Microscopy
Charge transfer
X ray photoelectron spectroscopy

Keywords

  • conductive fillers
  • copper nanoplates
  • copper nanowires
  • dimension control
  • electrodes
  • electronic inks

ASJC Scopus subject areas

  • Biotechnology
  • Biomaterials
  • Engineering (miscellaneous)

Cite this

Lee, J. W., Han, J., Lee, D. S., Bae, S., Lee, S. H., Lee, S. K., ... Kim, T. W. (2018). 2D Single-Crystalline Copper Nanoplates as a Conductive Filler for Electronic Ink Applications. Small, 14(8), [1703312]. https://doi.org/10.1002/smll.201703312

2D Single-Crystalline Copper Nanoplates as a Conductive Filler for Electronic Ink Applications. / Lee, Jin Won; Han, Jiyoon; Lee, Dong Su; Bae, Sukang; Lee, Sang Hyun; Lee, Seoung Ki; Moon, Byung Joon; Choi, Chel Jong; Wang, Gunuk; Kim, Tae Wook.

In: Small, Vol. 14, No. 8, 1703312, 22.02.2018.

Research output: Contribution to journalArticle

Lee, JW, Han, J, Lee, DS, Bae, S, Lee, SH, Lee, SK, Moon, BJ, Choi, CJ, Wang, G & Kim, TW 2018, '2D Single-Crystalline Copper Nanoplates as a Conductive Filler for Electronic Ink Applications', Small, vol. 14, no. 8, 1703312. https://doi.org/10.1002/smll.201703312
Lee, Jin Won ; Han, Jiyoon ; Lee, Dong Su ; Bae, Sukang ; Lee, Sang Hyun ; Lee, Seoung Ki ; Moon, Byung Joon ; Choi, Chel Jong ; Wang, Gunuk ; Kim, Tae Wook. / 2D Single-Crystalline Copper Nanoplates as a Conductive Filler for Electronic Ink Applications. In: Small. 2018 ; Vol. 14, No. 8.
@article{6599110ace0140448ef21d8054c6c0e3,
title = "2D Single-Crystalline Copper Nanoplates as a Conductive Filler for Electronic Ink Applications",
abstract = "Large-scale 2D single-crystalline copper nanoplates (Cu NPLs) are synthesized by a simple hydrothermal method. The combination of a mild reductant, stabilizer, and shape modifier allows the dimensional control of the Cu nanocrystals from 1D nanowires (NWs) to 2D nanoplates. High-resolution transmission electron microscopy (HR-TEM) reveals that the prepared Cu NPLs have a single-crystalline structure. From the X-ray photoelectron spectroscopy (XPS) analysis, it is found that iodine plays an important role in the modification of the copper nanocrystals through the formation of an adlayer on the basal plane of the nanoplates. Cu NPLs with an average edge length of 10 μm are successfully synthesized, and these Cu NPLs are the largest copper 2D crystals synthesized by a solution-based process so far. The application of the metallic 2D crystals as a semitransparent electrode proves their feasibility as a conductive filler, exhibiting very low sheet resistance (0.4 Ω ▫−1) compared to Cu NWs and a transmittance near 75{\%}. The efficient charge transport is due to the increased contact area between each Cu NPL, i.e., so-called plane contact (2D electrical contact). In addition, this type of contact enhances the current-carrying capability of the Cu NPL electrodes, implying that the large-size Cu NPLs are promising conductive fillers for printable electrode applications.",
keywords = "conductive fillers, copper nanoplates, copper nanowires, dimension control, electrodes, electronic inks",
author = "Lee, {Jin Won} and Jiyoon Han and Lee, {Dong Su} and Sukang Bae and Lee, {Sang Hyun} and Lee, {Seoung Ki} and Moon, {Byung Joon} and Choi, {Chel Jong} and Gunuk Wang and Kim, {Tae Wook}",
year = "2018",
month = "2",
day = "22",
doi = "10.1002/smll.201703312",
language = "English",
volume = "14",
journal = "Small",
issn = "1613-6810",
publisher = "Wiley-VCH Verlag",
number = "8",

}

TY - JOUR

T1 - 2D Single-Crystalline Copper Nanoplates as a Conductive Filler for Electronic Ink Applications

AU - Lee, Jin Won

AU - Han, Jiyoon

AU - Lee, Dong Su

AU - Bae, Sukang

AU - Lee, Sang Hyun

AU - Lee, Seoung Ki

AU - Moon, Byung Joon

AU - Choi, Chel Jong

AU - Wang, Gunuk

AU - Kim, Tae Wook

PY - 2018/2/22

Y1 - 2018/2/22

N2 - Large-scale 2D single-crystalline copper nanoplates (Cu NPLs) are synthesized by a simple hydrothermal method. The combination of a mild reductant, stabilizer, and shape modifier allows the dimensional control of the Cu nanocrystals from 1D nanowires (NWs) to 2D nanoplates. High-resolution transmission electron microscopy (HR-TEM) reveals that the prepared Cu NPLs have a single-crystalline structure. From the X-ray photoelectron spectroscopy (XPS) analysis, it is found that iodine plays an important role in the modification of the copper nanocrystals through the formation of an adlayer on the basal plane of the nanoplates. Cu NPLs with an average edge length of 10 μm are successfully synthesized, and these Cu NPLs are the largest copper 2D crystals synthesized by a solution-based process so far. The application of the metallic 2D crystals as a semitransparent electrode proves their feasibility as a conductive filler, exhibiting very low sheet resistance (0.4 Ω ▫−1) compared to Cu NWs and a transmittance near 75%. The efficient charge transport is due to the increased contact area between each Cu NPL, i.e., so-called plane contact (2D electrical contact). In addition, this type of contact enhances the current-carrying capability of the Cu NPL electrodes, implying that the large-size Cu NPLs are promising conductive fillers for printable electrode applications.

AB - Large-scale 2D single-crystalline copper nanoplates (Cu NPLs) are synthesized by a simple hydrothermal method. The combination of a mild reductant, stabilizer, and shape modifier allows the dimensional control of the Cu nanocrystals from 1D nanowires (NWs) to 2D nanoplates. High-resolution transmission electron microscopy (HR-TEM) reveals that the prepared Cu NPLs have a single-crystalline structure. From the X-ray photoelectron spectroscopy (XPS) analysis, it is found that iodine plays an important role in the modification of the copper nanocrystals through the formation of an adlayer on the basal plane of the nanoplates. Cu NPLs with an average edge length of 10 μm are successfully synthesized, and these Cu NPLs are the largest copper 2D crystals synthesized by a solution-based process so far. The application of the metallic 2D crystals as a semitransparent electrode proves their feasibility as a conductive filler, exhibiting very low sheet resistance (0.4 Ω ▫−1) compared to Cu NWs and a transmittance near 75%. The efficient charge transport is due to the increased contact area between each Cu NPL, i.e., so-called plane contact (2D electrical contact). In addition, this type of contact enhances the current-carrying capability of the Cu NPL electrodes, implying that the large-size Cu NPLs are promising conductive fillers for printable electrode applications.

KW - conductive fillers

KW - copper nanoplates

KW - copper nanowires

KW - dimension control

KW - electrodes

KW - electronic inks

UR - http://www.scopus.com/inward/record.url?scp=85042422453&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85042422453&partnerID=8YFLogxK

U2 - 10.1002/smll.201703312

DO - 10.1002/smll.201703312

M3 - Article

C2 - 29266730

AN - SCOPUS:85042422453

VL - 14

JO - Small

JF - Small

SN - 1613-6810

IS - 8

M1 - 1703312

ER -