3-Axes flexible tactile sensor fabricated by SI micromachining and packaging technology

K. Kim, K. R. Lee, Y. K. Kim, D. S. Lee, N. K. Cho, W. H. Kim, K. B. Park, H. D. Park, Y. K. Park, J. H. Kim, J. J. Pak

Research output: Chapter in Book/Report/Conference proceedingConference contribution

34 Citations (Scopus)

Abstract

We present the fabrication process and characteristics of a 3-axes flexible tactile sensor available for normal and shear mode fabricated using Si micromachining and packaging technologies. The fabrication processes for the 3 axes flexible tactile sensor were classified in the fabrication of sensor chips and their packaging on the flexible PCB. The variation rate of resistance was about 2.1%/N and 0.5%/N in applying normal and shear force, respectively. Because this tactile sensor can measure the variations of resistance of the semiconductor strain gauge for normal and shear force, it can be used to sense touch, pressure, hardness, and slip.

Original languageEnglish
Title of host publication19th IEEE International Conference on Micro Electro Mechanical Systems
Pages678-681
Number of pages4
Publication statusPublished - 2006
Event19th IEEE International Conference on Micro Electro Mechanical Systems - Istanbul, Turkey
Duration: 2006 Jan 222006 Jan 26

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume2006
ISSN (Print)1084-6999

Other

Other19th IEEE International Conference on Micro Electro Mechanical Systems
CountryTurkey
CityIstanbul
Period06/1/2206/1/26

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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