3-Axes flexible tactile sensor fabricated by SI micromachining and packaging technology

K. Kim, K. R. Lee, Y. K. Kim, D. S. Lee, N. K. Cho, W. H. Kim, K. B. Park, H. D. Park, Y. K. Park, J. H. Kim, James Jungho Pak

Research output: Chapter in Book/Report/Conference proceedingConference contribution

33 Citations (Scopus)

Abstract

We present the fabrication process and characteristics of a 3-axes flexible tactile sensor available for normal and shear mode fabricated using Si micromachining and packaging technologies. The fabrication processes for the 3 axes flexible tactile sensor were classified in the fabrication of sensor chips and their packaging on the flexible PCB. The variation rate of resistance was about 2.1%/N and 0.5%/N in applying normal and shear force, respectively. Because this tactile sensor can measure the variations of resistance of the semiconductor strain gauge for normal and shear force, it can be used to sense touch, pressure, hardness, and slip.

Original languageEnglish
Title of host publicationProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Pages678-681
Number of pages4
Volume2006
Publication statusPublished - 2006 Oct 24
Event19th IEEE International Conference on Micro Electro Mechanical Systems - Istanbul, Turkey
Duration: 2006 Jan 222006 Jan 26

Other

Other19th IEEE International Conference on Micro Electro Mechanical Systems
CountryTurkey
CityIstanbul
Period06/1/2206/1/26

Fingerprint

Micromachining
Packaging
Sensors
Fabrication
Strain gages
Polychlorinated biphenyls
Hardness
Semiconductor materials

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering
  • Control and Systems Engineering

Cite this

Kim, K., Lee, K. R., Kim, Y. K., Lee, D. S., Cho, N. K., Kim, W. H., ... Pak, J. J. (2006). 3-Axes flexible tactile sensor fabricated by SI micromachining and packaging technology. In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS) (Vol. 2006, pp. 678-681). [1627890]

3-Axes flexible tactile sensor fabricated by SI micromachining and packaging technology. / Kim, K.; Lee, K. R.; Kim, Y. K.; Lee, D. S.; Cho, N. K.; Kim, W. H.; Park, K. B.; Park, H. D.; Park, Y. K.; Kim, J. H.; Pak, James Jungho.

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). Vol. 2006 2006. p. 678-681 1627890.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kim, K, Lee, KR, Kim, YK, Lee, DS, Cho, NK, Kim, WH, Park, KB, Park, HD, Park, YK, Kim, JH & Pak, JJ 2006, 3-Axes flexible tactile sensor fabricated by SI micromachining and packaging technology. in Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). vol. 2006, 1627890, pp. 678-681, 19th IEEE International Conference on Micro Electro Mechanical Systems, Istanbul, Turkey, 06/1/22.
Kim K, Lee KR, Kim YK, Lee DS, Cho NK, Kim WH et al. 3-Axes flexible tactile sensor fabricated by SI micromachining and packaging technology. In Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). Vol. 2006. 2006. p. 678-681. 1627890
Kim, K. ; Lee, K. R. ; Kim, Y. K. ; Lee, D. S. ; Cho, N. K. ; Kim, W. H. ; Park, K. B. ; Park, H. D. ; Park, Y. K. ; Kim, J. H. ; Pak, James Jungho. / 3-Axes flexible tactile sensor fabricated by SI micromachining and packaging technology. Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS). Vol. 2006 2006. pp. 678-681
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