3-Axes flexible tactile sensor fabricated by SI micromachining and packaging technology

K. Kim, K. R. Lee, Y. K. Kim, D. S. Lee, N. K. Cho, W. H. Kim, K. B. Park, H. D. Park, Y. K. Park, J. H. Kim, J. J. Pak

Research output: Chapter in Book/Report/Conference proceedingConference contribution

34 Citations (Scopus)

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Engineering & Materials Science