3D MEMS antenna for IR sensor using novel UV-lithography, plastic micromachining and mesh structure bonding technique

Jong Yeon Park, Kun Tae Kim, Sung Moon, James Jungho Pak

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

This paper describes the novel UV-lithography technique for fabrication of 3D feed horn mold structure array using implementation of mirror reflected parallel beam illuminator (MRPBI) system, fabrication of 3D feed horn MEMS antenna's plate using plastic micromachining (PMM) by polydimethylsiloxane (PDMS) and the 3D MEMS antenna array are assembled using novel 3D MEMS bonding technique by mesh structure bonding (MSB) method.

Original languageEnglish
Title of host publication2003 IEEE/LEOS International Conference on Optical MEMS
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages79-80
Number of pages2
ISBN (Print)078037830X, 9780780378308
DOIs
Publication statusPublished - 2003
Event2003 IEEE/LEOS International Conference on Optical MEMS - Waikoloa, United States
Duration: 2003 Aug 182003 Aug 21

Other

Other2003 IEEE/LEOS International Conference on Optical MEMS
CountryUnited States
CityWaikoloa
Period03/8/1803/8/21

Keywords

  • Antenna arrays
  • Bonding
  • Fabrication
  • Feeds
  • Horn antennas
  • Infrared sensors
  • Micromachining
  • Micromechanical devices
  • Plastics
  • Reflector antennas

ASJC Scopus subject areas

  • Engineering(all)

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