3D mesh compression using triangle fan structure

Jae Young Sim, Chang-Su Kim, Sang U. Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

In this paper, we propose an efficient compression algorithm for 3D triangular mesh, which is composed of connectivity data and geometry data. First, the vertex degree warping method is proposed to compress the connectivity data losslessly. While the connectivity data and the geometry data are encoded independently in most conventional algorithms, the geometrical information is exploited to efficiently compress the connectivity data in the proposed approach. Second, the dual parallelogram prediction technique is proposed as an effective geometry prediction scheme. By adopting the triangle fan structure, the proposed algorithm provides smaller prediction error than the conventional algorithm. Simulation results for various 3D mesh models demonstrate that the proposed algorithm yields higher compression ratio than the conventional algorithm.

Original languageEnglish
Title of host publicationProceedings - IEEE International Symposium on Circuits and Systems
Volume2
Publication statusPublished - 2002
Externally publishedYes
Event2002 IEEE International Symposium on Circuits and Systems - Phoenix, AZ, United States
Duration: 2002 May 262002 May 29

Other

Other2002 IEEE International Symposium on Circuits and Systems
CountryUnited States
CityPhoenix, AZ
Period02/5/2602/5/29

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Geometry

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Sim, J. Y., Kim, C-S., & Lee, S. U. (2002). 3D mesh compression using triangle fan structure. In Proceedings - IEEE International Symposium on Circuits and Systems (Vol. 2)

3D mesh compression using triangle fan structure. / Sim, Jae Young; Kim, Chang-Su; Lee, Sang U.

Proceedings - IEEE International Symposium on Circuits and Systems. Vol. 2 2002.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sim, JY, Kim, C-S & Lee, SU 2002, 3D mesh compression using triangle fan structure. in Proceedings - IEEE International Symposium on Circuits and Systems. vol. 2, 2002 IEEE International Symposium on Circuits and Systems, Phoenix, AZ, United States, 02/5/26.
Sim JY, Kim C-S, Lee SU. 3D mesh compression using triangle fan structure. In Proceedings - IEEE International Symposium on Circuits and Systems. Vol. 2. 2002
Sim, Jae Young ; Kim, Chang-Su ; Lee, Sang U. / 3D mesh compression using triangle fan structure. Proceedings - IEEE International Symposium on Circuits and Systems. Vol. 2 2002.
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