3D Printer-Based Encapsulated Origami Electronics for Extreme System Stretchability and High Areal Coverage

Mansik Jo, Seunghwan Bae, Injong Oh, Ji Hun Jeong, Byungsoo Kang, Seok Joon Hwang, Seung S. Lee, Hae Jung Son, Byung Moo Moon, Min Jae Ko, Phillip Lee

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Stretchability and areal coverage of active devices are critical design considerations of stretchable or wearable photovoltaics and photodetections where high areal coverages are required. However, simultaneously maximizing both properties in conventional island-bridge structures through traditional two-dimensional manufacturing processes is difficult due to their inherent trade-offs. Here, a 3D printer-based strategy to achieve extreme system stretchability and high areal coverage through combining fused deposition modeling (FDM) and flexible conductive nanocomposites is reported. Distinguished from typical approaches of using conductive filaments for FDM which have a flexibility dilemma and conductivity trade-offs, the proposed axiomatic approach to embed a two-dimensional silver nanowire percolation network into the surfaces of flexible 3D printed structures offers sufficient conductivity and deformability as well as additional benefits of electrical junction enhancement and encapsulation of silver nanowires. Kirigami/origami-pattern-guided three-dimensional arrangements of encapsulated interconnections provide efficient control over stretchability and areal coverage. The suggested process enables a perovskite solar module with an initial areal coverage of â'¼97% to be electrically and mechanically reversible with 400% system stretchability and 25※000% interconnect stretchability under the 1000 cycle test, by folding down or hiding the origami-applied interconnects under the islands. This 3D printing strategy of potentially low cost, large size capabilities, and high speed is promising for highly flexible future energy conversion applications.

Original languageEnglish
Pages (from-to)12500-12510
Number of pages11
JournalACS Nano
Volume13
Issue number11
DOIs
Publication statusPublished - 2019 Nov 26

Keywords

  • 3D printing encapsulation
  • areal coverage
  • fused deposition modeling
  • hidden origami
  • stretchable electronics

ASJC Scopus subject areas

  • Materials Science(all)
  • Engineering(all)
  • Physics and Astronomy(all)

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  • Cite this

    Jo, M., Bae, S., Oh, I., Jeong, J. H., Kang, B., Hwang, S. J., Lee, S. S., Son, H. J., Moon, B. M., Ko, M. J., & Lee, P. (2019). 3D Printer-Based Encapsulated Origami Electronics for Extreme System Stretchability and High Areal Coverage. ACS Nano, 13(11), 12500-12510. https://doi.org/10.1021/acsnano.9b02362