3D Printer-Based Encapsulated Origami Electronics for Extreme System Stretchability and High Areal Coverage

Mansik Jo, Seunghwan Bae, Injong Oh, Ji Hun Jeong, Byungsoo Kang, Seok Joon Hwang, Seung S. Lee, Hae Jung Son, Byung Moo Moon, Min Jae Ko, Phillip Lee

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18 Citations (Scopus)

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