A 283.2μW 800Mb/s/pin DLL-based data self-aligner for Through-Silicon Via (TSV) interface

Hyun Woo Lee, Soo Bin Lim, Junyoung Song, Ja Beom Koo, Dae Han Kwon, Jong Ho Kang, Yunsaing Kim, Young Jung Choi, Kunwoo Park, Byong Tae Chung, Chulwoo Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

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Chemical Compounds

Engineering & Materials Science