A 80x60 Microbolometer CMOS Thermal Imager Integrated with a Low-Noise 12-B DAC

Ki Duk Kim, Seunghyun Park, Byunghun Lee, Hyung Min Lee, Gyu Hyeong Cho

Research output: Contribution to journalArticlepeer-review

Abstract

A low-cost 80×60 microbolometer CMOS (complementary metal-oxide-semiconductor) thermal imager is presented. The imager system integrated with a proposed 12-b biasing digital-to-analog converter (DAC) has 100 ms start-up time, which is 300× faster than commercial products, while ensuring comparable 100 mK noise-equivalent temperature difference. The low-noise biasing DAC adopts a current-mode divider-stacking structure and a bit-inversion technique, leading to mismatch-insensitive operation. The 12-b biasing DAC in a 0.18 μm CMOS imager IC has a low noise of 1.89 μVrms and INL (integral non-linearity)/DNL (differential non-linearity) of 0.14/0.09 LSB, respectively.

Original languageEnglish
Pages (from-to)8604-8608
Number of pages5
JournalIEEE Transactions on Industrial Electronics
Volume69
Issue number8
DOIs
Publication statusPublished - 2022 Aug 1

Keywords

  • CMOS thermal imager
  • digital-to-analog converter (DAC)
  • microbolometer
  • noise-equivalent temperature difference (NETD)

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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