A Bidirectional High-Voltage Dual-Input Buck Converter for Triboelectric Energy-Harvesting Interface Achieving 70.72% End-to-End Efficiency

Inho Park, Junyoung Maeng, Minseob Shim, Junwon Jeong, Chulwoo Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

A bidirectional high-voltage (HV) dual-input (DI) buck converter and a fully integrated maximum power point (MPP) tracker for a triboelectric (TE) energy-harvesting (EH) system are proposed. The proposed MPP tracker carries out the fractional open-circuit voltage (FOCV) method without any external resistor for voltage down conversion. The proposed buck converter regulates two high DC voltages from a triboelectric nanogenerator (TENG) up to 70 V with a single shared inductor. By reducing the capacitance at the switching node, the power conversion efficiency is improved, and the maximum end-to-end efficiency is 70.72%, which is 21.15% higher than prior work.

Original languageEnglish
Title of host publication2019 Symposium on VLSI Circuits, VLSI Circuits 2019 - Digest of Technical Papers
PublisherInstitute of Electrical and Electronics Engineers Inc.
PagesC326-C327
ISBN (Electronic)9784863487185
DOIs
Publication statusPublished - 2019 Jun
Event33rd Symposium on VLSI Circuits, VLSI Circuits 2019 - Kyoto, Japan
Duration: 2019 Jun 92019 Jun 14

Publication series

NameIEEE Symposium on VLSI Circuits, Digest of Technical Papers
Volume2019-June

Conference

Conference33rd Symposium on VLSI Circuits, VLSI Circuits 2019
CountryJapan
CityKyoto
Period19/6/919/6/14

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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    Park, I., Maeng, J., Shim, M., Jeong, J., & Kim, C. (2019). A Bidirectional High-Voltage Dual-Input Buck Converter for Triboelectric Energy-Harvesting Interface Achieving 70.72% End-to-End Efficiency. In 2019 Symposium on VLSI Circuits, VLSI Circuits 2019 - Digest of Technical Papers (pp. C326-C327). [8778018] (IEEE Symposium on VLSI Circuits, Digest of Technical Papers; Vol. 2019-June). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/VLSIC.2019.8778018