A classification and verification of real pattern defects with dust filtering in tape substrate inspection

Young Jun Roh, Cheol Woo Kim, Jung Yeol Yeom, Chang Ook Jung, Dae Hwa Jeong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)


Tape substrate pattern of ultra-fine pitch circuit less than 10 micrometers in pattern width, is required to be inspected through high resolution optics. In the process of picking out defects at the level of the critical dimension through image processing, however, trivial blemishes formed by dust or micro particles may be detected simultaneously. This leads to unnecessary work on the part of operators reviewing and verifying the additional detected points. To maximize the efficiency of the inspection process, we need to identify and classify the defect candidates whether it is a real pattern defect or simply a trivial blemish by dust. Since a real defect arising from under or over etching bears inherent features in shape and brightness, it can thus be discriminated from other trivial blemishes. In this article, we propose an image feature based defect classification method, where proper measures were obtained from a series of image analysis with FFT. Based on the data collected from experiments, we devised a statistic model for classification.

Original languageEnglish
Title of host publicationOptomechatronic Computer-Vision Systems II
Publication statusPublished - 2007
Externally publishedYes
EventOptomechatronic Computer-Vision Systems II - Lausanne, Switzerland
Duration: 2007 Oct 82007 Oct 10

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X


ConferenceOptomechatronic Computer-Vision Systems II


  • Classification
  • Inspection
  • Tape substrate

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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