TY - GEN
T1 - A Keccak-based wireless authentication tag with per-query key update and power-glitch attack countermeasures
AU - Juvekar, Chiraag S.
AU - Lee, Hyung Min
AU - Kwong, Joyce
AU - Chandrakasan, Anantha P.
PY - 2016/2/23
Y1 - 2016/2/23
N2 - Counterfeiting is a major problem plaguing global supply chains. While small low-cost tagging solutions for supply-chain management exist, security in the face of fault-injection [1] and side-channel attacks [2] remains a concern. Power glitch attacks [3] in particular attempt to leak key-bits by inducing fault conditions during cryptographic operation through the use of over-voltage and under-voltage conditions. This paper presents the design of a secure authentication tag with wireless power and data delivery optimized for compact size and near-field applications. Power-glitch attacks are mitigated through state backup on FeRAM based non-volatile flip-flops (NVDFFs) [4]. The tag uses Keccak [5] (the cryptographic core of SHA3) to update the key before each protocol invocation, limiting side-channel leakage to a single trace per key.
AB - Counterfeiting is a major problem plaguing global supply chains. While small low-cost tagging solutions for supply-chain management exist, security in the face of fault-injection [1] and side-channel attacks [2] remains a concern. Power glitch attacks [3] in particular attempt to leak key-bits by inducing fault conditions during cryptographic operation through the use of over-voltage and under-voltage conditions. This paper presents the design of a secure authentication tag with wireless power and data delivery optimized for compact size and near-field applications. Power-glitch attacks are mitigated through state backup on FeRAM based non-volatile flip-flops (NVDFFs) [4]. The tag uses Keccak [5] (the cryptographic core of SHA3) to update the key before each protocol invocation, limiting side-channel leakage to a single trace per key.
UR - http://www.scopus.com/inward/record.url?scp=84962812275&partnerID=8YFLogxK
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U2 - 10.1109/ISSCC.2016.7418021
DO - 10.1109/ISSCC.2016.7418021
M3 - Conference contribution
AN - SCOPUS:84962812275
T3 - Digest of Technical Papers - IEEE International Solid-State Circuits Conference
SP - 290
EP - 291
BT - 2016 IEEE International Solid-State Circuits Conference, ISSCC 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 63rd IEEE International Solid-State Circuits Conference, ISSCC 2016
Y2 - 31 January 2016 through 4 February 2016
ER -