A Kinetic Study of Biphenyl Type Epoxy-Xylok Resin System with Different Kinds of Catalysts

Seung Han, Whan Gun Kim, Ho Gyu Yoon, Tak Jin Moon

Research output: Contribution to journalArticle

11 Citations (Scopus)

Abstract

The investigation of cure kinetics of biphenyl epoxy (4,4-diglycidyloxy-3,3,5,5-tetramethyl biphenyl)-xylok resin system with four different catalysts was performed by differential scanning calorimeter using an isothermal approach. All kinetic parameters of the curing reaction including the reaction order, activation energy and rate constant were calculated and reported. The results indicate that the curing reaction of the formulations using triphenylphosphine (TPP) and 1-benzyl-2-methylimidazole (1B2MI) as a catalyst proceeds through a first order kinetic mechanism, whereas that of the formulations using diazabicycloundecene (DBU) and tetraphenyl phosphonium tetraphenyl borate (TPP-TPB) proceeds by an autocatalytic kinetic mechanism. To describe the cure reaction in the latter stage, we have used the semiempirical relationship proposed by Chern and Poehlein. By combining an nth order kinetic model or an autocatalytic model with a diffusion factor, it is possible to predict the cure kinetics of each catalytic system over the whole range of conversion.

Original languageEnglish
Pages (from-to)1199-1203
Number of pages5
JournalBulletin of the Korean Chemical Society
Volume18
Issue number11
Publication statusPublished - 1997 Dec 1

Fingerprint

Epoxy Resins
Catalysts
Kinetics
Curing
Borates
Calorimeters
Kinetic parameters
Rate constants
Resins
Activation energy
diphenyl
Scanning

ASJC Scopus subject areas

  • Chemistry(all)

Cite this

A Kinetic Study of Biphenyl Type Epoxy-Xylok Resin System with Different Kinds of Catalysts. / Han, Seung; Kim, Whan Gun; Yoon, Ho Gyu; Moon, Tak Jin.

In: Bulletin of the Korean Chemical Society, Vol. 18, No. 11, 01.12.1997, p. 1199-1203.

Research output: Contribution to journalArticle

@article{8d0e828045244dd9bc73a0e8f92f5f2a,
title = "A Kinetic Study of Biphenyl Type Epoxy-Xylok Resin System with Different Kinds of Catalysts",
abstract = "The investigation of cure kinetics of biphenyl epoxy (4,4-diglycidyloxy-3,3,5,5-tetramethyl biphenyl)-xylok resin system with four different catalysts was performed by differential scanning calorimeter using an isothermal approach. All kinetic parameters of the curing reaction including the reaction order, activation energy and rate constant were calculated and reported. The results indicate that the curing reaction of the formulations using triphenylphosphine (TPP) and 1-benzyl-2-methylimidazole (1B2MI) as a catalyst proceeds through a first order kinetic mechanism, whereas that of the formulations using diazabicycloundecene (DBU) and tetraphenyl phosphonium tetraphenyl borate (TPP-TPB) proceeds by an autocatalytic kinetic mechanism. To describe the cure reaction in the latter stage, we have used the semiempirical relationship proposed by Chern and Poehlein. By combining an nth order kinetic model or an autocatalytic model with a diffusion factor, it is possible to predict the cure kinetics of each catalytic system over the whole range of conversion.",
author = "Seung Han and Kim, {Whan Gun} and Yoon, {Ho Gyu} and Moon, {Tak Jin}",
year = "1997",
month = "12",
day = "1",
language = "English",
volume = "18",
pages = "1199--1203",
journal = "Bulletin of the Korean Chemical Society",
issn = "0253-2964",
publisher = "Wiley-Blackwell",
number = "11",

}

TY - JOUR

T1 - A Kinetic Study of Biphenyl Type Epoxy-Xylok Resin System with Different Kinds of Catalysts

AU - Han, Seung

AU - Kim, Whan Gun

AU - Yoon, Ho Gyu

AU - Moon, Tak Jin

PY - 1997/12/1

Y1 - 1997/12/1

N2 - The investigation of cure kinetics of biphenyl epoxy (4,4-diglycidyloxy-3,3,5,5-tetramethyl biphenyl)-xylok resin system with four different catalysts was performed by differential scanning calorimeter using an isothermal approach. All kinetic parameters of the curing reaction including the reaction order, activation energy and rate constant were calculated and reported. The results indicate that the curing reaction of the formulations using triphenylphosphine (TPP) and 1-benzyl-2-methylimidazole (1B2MI) as a catalyst proceeds through a first order kinetic mechanism, whereas that of the formulations using diazabicycloundecene (DBU) and tetraphenyl phosphonium tetraphenyl borate (TPP-TPB) proceeds by an autocatalytic kinetic mechanism. To describe the cure reaction in the latter stage, we have used the semiempirical relationship proposed by Chern and Poehlein. By combining an nth order kinetic model or an autocatalytic model with a diffusion factor, it is possible to predict the cure kinetics of each catalytic system over the whole range of conversion.

AB - The investigation of cure kinetics of biphenyl epoxy (4,4-diglycidyloxy-3,3,5,5-tetramethyl biphenyl)-xylok resin system with four different catalysts was performed by differential scanning calorimeter using an isothermal approach. All kinetic parameters of the curing reaction including the reaction order, activation energy and rate constant were calculated and reported. The results indicate that the curing reaction of the formulations using triphenylphosphine (TPP) and 1-benzyl-2-methylimidazole (1B2MI) as a catalyst proceeds through a first order kinetic mechanism, whereas that of the formulations using diazabicycloundecene (DBU) and tetraphenyl phosphonium tetraphenyl borate (TPP-TPB) proceeds by an autocatalytic kinetic mechanism. To describe the cure reaction in the latter stage, we have used the semiempirical relationship proposed by Chern and Poehlein. By combining an nth order kinetic model or an autocatalytic model with a diffusion factor, it is possible to predict the cure kinetics of each catalytic system over the whole range of conversion.

UR - http://www.scopus.com/inward/record.url?scp=0642273389&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0642273389&partnerID=8YFLogxK

M3 - Article

VL - 18

SP - 1199

EP - 1203

JO - Bulletin of the Korean Chemical Society

JF - Bulletin of the Korean Chemical Society

SN - 0253-2964

IS - 11

ER -