Abstract
We propose a novel packaging method of a thin polyimide multichannel microelectrode. For the simple electrical connection of polyimide (PI) electrodes, we made a via-hole at the interconnection pads of thin PI electrodes, and constructed a Ni ring by electroplating through the via-hole for the stable soldering and strong adhesion of the electrode to PCB. For the construction of a well-organized Ni ring, the electroplating condition was optimized, and the electrical property of the packaged electrode was evaluated. A 40 channel thin PI electrode was fabricated and packaged by the proposed method, and we performed the animal experiment with this packaged electrode for the high-resolution recording of neural signals from the skull of a rat.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS |
| Pages | 4482-4484 |
| Number of pages | 3 |
| DOIs | |
| Publication status | Published - 2012 Dec 14 |
| Event | 34th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS 2012 - San Diego, CA, United States Duration: 2012 Aug 28 → 2012 Sep 1 |
Other
| Other | 34th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS 2012 |
|---|---|
| Country | United States |
| City | San Diego, CA |
| Period | 12/8/28 → 12/9/1 |
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ASJC Scopus subject areas
- Computer Vision and Pattern Recognition
- Signal Processing
- Biomedical Engineering
- Health Informatics
Cite this
A method for stable electrical connection of a multi-channeled polyimide electrode with PCB. / Baek, Dong Hyun; Jung, Ha Chul; Kim, Seon Min; Im, Chang Hwan; Pak, James Jungho; Lee, Sang Hoon.
Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS. 2012. p. 4482-4484 6346962.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - A method for stable electrical connection of a multi-channeled polyimide electrode with PCB
AU - Baek, Dong Hyun
AU - Jung, Ha Chul
AU - Kim, Seon Min
AU - Im, Chang Hwan
AU - Pak, James Jungho
AU - Lee, Sang Hoon
PY - 2012/12/14
Y1 - 2012/12/14
N2 - We propose a novel packaging method of a thin polyimide multichannel microelectrode. For the simple electrical connection of polyimide (PI) electrodes, we made a via-hole at the interconnection pads of thin PI electrodes, and constructed a Ni ring by electroplating through the via-hole for the stable soldering and strong adhesion of the electrode to PCB. For the construction of a well-organized Ni ring, the electroplating condition was optimized, and the electrical property of the packaged electrode was evaluated. A 40 channel thin PI electrode was fabricated and packaged by the proposed method, and we performed the animal experiment with this packaged electrode for the high-resolution recording of neural signals from the skull of a rat.
AB - We propose a novel packaging method of a thin polyimide multichannel microelectrode. For the simple electrical connection of polyimide (PI) electrodes, we made a via-hole at the interconnection pads of thin PI electrodes, and constructed a Ni ring by electroplating through the via-hole for the stable soldering and strong adhesion of the electrode to PCB. For the construction of a well-organized Ni ring, the electroplating condition was optimized, and the electrical property of the packaged electrode was evaluated. A 40 channel thin PI electrode was fabricated and packaged by the proposed method, and we performed the animal experiment with this packaged electrode for the high-resolution recording of neural signals from the skull of a rat.
UR - http://www.scopus.com/inward/record.url?scp=84870789214&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84870789214&partnerID=8YFLogxK
U2 - 10.1109/EMBC.2012.6346962
DO - 10.1109/EMBC.2012.6346962
M3 - Conference contribution
C2 - 23366923
AN - SCOPUS:84870789214
SN - 9781424441198
SP - 4482
EP - 4484
BT - Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS
ER -