TY - GEN
T1 - A method for stable electrical connection of a multi-channeled polyimide electrode with PCB
AU - Baek, Dong Hyun
AU - Jung, Ha Chul
AU - Kim, Seon Min
AU - Im, Chang Hwan
AU - Pak, James Jungho
AU - Lee, Sang Hoon
PY - 2012
Y1 - 2012
N2 - We propose a novel packaging method of a thin polyimide multichannel microelectrode. For the simple electrical connection of polyimide (PI) electrodes, we made a via-hole at the interconnection pads of thin PI electrodes, and constructed a Ni ring by electroplating through the via-hole for the stable soldering and strong adhesion of the electrode to PCB. For the construction of a well-organized Ni ring, the electroplating condition was optimized, and the electrical property of the packaged electrode was evaluated. A 40 channel thin PI electrode was fabricated and packaged by the proposed method, and we performed the animal experiment with this packaged electrode for the high-resolution recording of neural signals from the skull of a rat.
AB - We propose a novel packaging method of a thin polyimide multichannel microelectrode. For the simple electrical connection of polyimide (PI) electrodes, we made a via-hole at the interconnection pads of thin PI electrodes, and constructed a Ni ring by electroplating through the via-hole for the stable soldering and strong adhesion of the electrode to PCB. For the construction of a well-organized Ni ring, the electroplating condition was optimized, and the electrical property of the packaged electrode was evaluated. A 40 channel thin PI electrode was fabricated and packaged by the proposed method, and we performed the animal experiment with this packaged electrode for the high-resolution recording of neural signals from the skull of a rat.
UR - http://www.scopus.com/inward/record.url?scp=84870789214&partnerID=8YFLogxK
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U2 - 10.1109/EMBC.2012.6346962
DO - 10.1109/EMBC.2012.6346962
M3 - Conference contribution
C2 - 23366923
AN - SCOPUS:84870789214
SN - 9781424441198
T3 - Proceedings of the Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS
SP - 4482
EP - 4484
BT - 2012 Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBC 2012
T2 - 34th Annual International Conference of the IEEE Engineering in Medicine and Biology Society, EMBS 2012
Y2 - 28 August 2012 through 1 September 2012
ER -