A new method for A single semi-conducting nanotube device

Hyung Woo Lee, Soo Hyun Kim, Yoon Keun Kwak, Chang-Soo Han

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We report a new technology for the selective deposition of a semi-conducting single-walled carbon nanotube(SWNT) between two electrodes. This technology consists of two processes. First, to separate the most of metallic nanotubes from semi-conducting ones and align the nanotubes, we applied dc and ac voltage to the electrodes respectively. But, in spite of the separation of the metallic nanotubes from semi-conducting nanotubes, some of metallic nanotubes and semi-conducing nanotubes are still deposited together. The second process is to burn the metallic and semi-conducting nanotubes by applying the voltage between two electrodes which enable to obtain a single semi-conducting nanotube structure. We verified the trace of the burning by SEM images or AFM images, and checked the characteristic of semi-conducing nanotubes through the I-V characteristic graph.

Original languageEnglish
Title of host publicationAmerican Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
Pages481-485
Number of pages5
Volume4
DOIs
Publication statusPublished - 2004 Dec 1
Externally publishedYes
Event2004 ASME International Mechanical Engineering Congress and Exposition, IMECE 2004 - Anaheim, CA, United States
Duration: 2004 Nov 132004 Nov 19

Other

Other2004 ASME International Mechanical Engineering Congress and Exposition, IMECE 2004
CountryUnited States
CityAnaheim, CA
Period04/11/1304/11/19

Keywords

  • Burning technique
  • Dielectrophoresis
  • Semi-conducting carbon nanotube
  • Separation
  • Single-walled carbon nanotube (SWNT)
  • Transistor

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Lee, H. W., Kim, S. H., Kwak, Y. K., & Han, C-S. (2004). A new method for A single semi-conducting nanotube device. In American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP (Vol. 4, pp. 481-485). [IMECE2004-61602] https://doi.org/10.1115/IMECE2004-61602