TY - GEN
T1 - A novel layer shaping method to reduce far-end crosstalk noise in microstrip lines using 3D printer
AU - Lim, Jaehyuk
AU - Lee, Seungjin
AU - Lee, Jaehoon
N1 - Funding Information:
ACKNOWLEDGMENT This work was supported by the Basic Science Research Program through the National Research Foundation of Korea (NRF), funded by the Ministry of Education, Science, and Technology, Rep. of Korea (NRF - 2018R1D1A1B07049347).
Publisher Copyright:
© 2020 IEEE.
PY - 2020/2
Y1 - 2020/2
N2 - In this paper, a novel layer shaping method to reduce far-end crosstalk (FEXT) noise in multiple microstrip lines was proposed. To reduce FEXT noise induced in adjacent microstrip lines, mushroom-shaped dielectric structure (MSDS) was created between the microstrip lines. The prototypes were fabricated using 3D printer to avoid increased complexity, and the effect of the proposed MSDS was verifiedfrom simulated and measured results.
AB - In this paper, a novel layer shaping method to reduce far-end crosstalk (FEXT) noise in multiple microstrip lines was proposed. To reduce FEXT noise induced in adjacent microstrip lines, mushroom-shaped dielectric structure (MSDS) was created between the microstrip lines. The prototypes were fabricated using 3D printer to avoid increased complexity, and the effect of the proposed MSDS was verifiedfrom simulated and measured results.
KW - 3D printer
KW - Far-end crosstalk (FEXT)
KW - Layer shaping method
KW - Mushroom-shaped dielectric structure(MSDS)
UR - http://www.scopus.com/inward/record.url?scp=85084181957&partnerID=8YFLogxK
U2 - 10.1109/AMS48904.2020.9059422
DO - 10.1109/AMS48904.2020.9059422
M3 - Conference contribution
AN - SCOPUS:85084181957
T3 - 2020 4th Australian Microwave Symposium, AMS 2020
BT - 2020 4th Australian Microwave Symposium, AMS 2020
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 4th Australian Microwave Symposium, AMS 2020
Y2 - 13 February 2020 through 14 February 2020
ER -