A novel layer shaping method to reduce far-end crosstalk noise in microstrip lines using 3D printer

Jaehyuk Lim, Seungjin Lee, Jaehoon Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, a novel layer shaping method to reduce far-end crosstalk (FEXT) noise in multiple microstrip lines was proposed. To reduce FEXT noise induced in adjacent microstrip lines, mushroom-shaped dielectric structure (MSDS) was created between the microstrip lines. The prototypes were fabricated using 3D printer to avoid increased complexity, and the effect of the proposed MSDS was verifiedfrom simulated and measured results.

Original languageEnglish
Title of host publication2020 4th Australian Microwave Symposium, AMS 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728147840
DOIs
Publication statusPublished - 2020 Feb
Event4th Australian Microwave Symposium, AMS 2020 - Sydney, Australia
Duration: 2020 Feb 132020 Feb 14

Publication series

Name2020 4th Australian Microwave Symposium, AMS 2020

Conference

Conference4th Australian Microwave Symposium, AMS 2020
CountryAustralia
CitySydney
Period20/2/1320/2/14

Keywords

  • 3D printer
  • Far-end crosstalk (FEXT)
  • Layer shaping method
  • Mushroom-shaped dielectric structure(MSDS)

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Instrumentation

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  • Cite this

    Lim, J., Lee, S., & Lee, J. (2020). A novel layer shaping method to reduce far-end crosstalk noise in microstrip lines using 3D printer. In 2020 4th Australian Microwave Symposium, AMS 2020 [9059422] (2020 4th Australian Microwave Symposium, AMS 2020). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/AMS48904.2020.9059422