A novel low-temperature microcap packaging using SU-8 bonding

Y. K. Kim, S. H. Yi, Seung Wook Kim, Byeong Kwon Ju

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

In this paper, we report a new technology for lightweight, low temperature bonding process with thin film polymer microcap. Polymer (SU-8) was used both for the intermediate adhesive layer and as a cap structure. Silicon oxide thin film was deposited using furnace to separate the microcap from the carrier wafer. The measured tensile strength of the package is in the range of 7-17MPa. This thin-film polymer microcap on the host wafer was successfully demonstrated through low-temperature bonding and bulk micromachining. The experimental result shows that relatively high bonding strength at low bonding temperature can be achieved.

Original languageEnglish
Title of host publicationTRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems
Pages2107-2110
Number of pages4
DOIs
Publication statusPublished - 2007 Dec 1
Event4th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS '07 - Lyon, France
Duration: 2007 Jun 102007 Jun 14

Other

Other4th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS '07
CountryFrance
CityLyon
Period07/6/1007/6/14

Fingerprint

Packaging
Thin films
Polymers
Temperature
Silicon oxides
Micromachining
Oxide films
Adhesives
Furnaces
Tensile strength

Keywords

  • Bonding
  • Low temperature
  • Microcap
  • SU-8

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Kim, Y. K., Yi, S. H., Kim, S. W., & Ju, B. K. (2007). A novel low-temperature microcap packaging using SU-8 bonding. In TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems (pp. 2107-2110). [4300581] https://doi.org/10.1109/SENSOR.2007.4300581

A novel low-temperature microcap packaging using SU-8 bonding. / Kim, Y. K.; Yi, S. H.; Kim, Seung Wook; Ju, Byeong Kwon.

TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems. 2007. p. 2107-2110 4300581.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kim, YK, Yi, SH, Kim, SW & Ju, BK 2007, A novel low-temperature microcap packaging using SU-8 bonding. in TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems., 4300581, pp. 2107-2110, 4th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS '07, Lyon, France, 07/6/10. https://doi.org/10.1109/SENSOR.2007.4300581
Kim YK, Yi SH, Kim SW, Ju BK. A novel low-temperature microcap packaging using SU-8 bonding. In TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems. 2007. p. 2107-2110. 4300581 https://doi.org/10.1109/SENSOR.2007.4300581
Kim, Y. K. ; Yi, S. H. ; Kim, Seung Wook ; Ju, Byeong Kwon. / A novel low-temperature microcap packaging using SU-8 bonding. TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems. 2007. pp. 2107-2110
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