A novel low-temperature microcap packaging using SU-8 bonding

Y. K. Kim, S. H. Yi, S. W. Kim, B. K. Ju

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

In this paper, we report a new technology for lightweight, low temperature bonding process with thin film polymer microcap. Polymer (SU-8) was used both for the intermediate adhesive layer and as a cap structure. Silicon oxide thin film was deposited using furnace to separate the microcap from the carrier wafer. The measured tensile strength of the package is in the range of 7-17MPa. This thin-film polymer microcap on the host wafer was successfully demonstrated through low-temperature bonding and bulk micromachining. The experimental result shows that relatively high bonding strength at low bonding temperature can be achieved.

Original languageEnglish
Title of host publicationTRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems
Pages2107-2110
Number of pages4
DOIs
Publication statusPublished - 2007
Event4th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS '07 - Lyon, France
Duration: 2007 Jun 102007 Jun 14

Publication series

NameTRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems

Other

Other4th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS '07
CountryFrance
CityLyon
Period07/6/1007/6/14

Keywords

  • Bonding
  • Low temperature
  • Microcap
  • SU-8

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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