A novel software solution for localized thermal problems

Sung Woo Jung, Kevin Skadron

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Citations (Scopus)

Abstract

In this paper, we propose a temperature-aware DFS (Dynamic Frequency Scaling) technique using the performance counters that is already embedded in the commercial microprocessors. By using performance counters and simple regression analysis, we can predict the localized temperature and efficiently schedule the tasks considering the temperature. The proposed technique is especially beneficial to potential localized thermal problems that are inevitable due to limited number of costly CMOS thermal sensors. When localized thermal problems that were not detected by thermal sensors are found after fabrication, the thermal problems can be avoided by the proposed software solution without re-fabrication costs. The evaluation results show that the proposed technique is comparable to the DFS technique using CMOS thermal sensors.

Original languageEnglish
Title of host publicationLecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics)
PublisherSpringer Verlag
Pages63-74
Number of pages12
Volume4330
ISBN (Print)9783540680673
Publication statusPublished - 2006
Event4th International Symposium on Parallel and Distributed Processing and Applications, ISPA 2006 - Sorrento, Italy
Duration: 2006 Dec 42006 Dec 6

Publication series

NameLecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics)
Volume4330
ISSN (Print)03029743
ISSN (Electronic)16113349

Other

Other4th International Symposium on Parallel and Distributed Processing and Applications, ISPA 2006
CountryItaly
CitySorrento
Period06/12/406/12/6

ASJC Scopus subject areas

  • Computer Science(all)
  • Theoretical Computer Science

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  • Cite this

    Jung, S. W., & Skadron, K. (2006). A novel software solution for localized thermal problems. In Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics) (Vol. 4330, pp. 63-74). (Lecture Notes in Computer Science (including subseries Lecture Notes in Artificial Intelligence and Lecture Notes in Bioinformatics); Vol. 4330). Springer Verlag.