A unified modeling framework for explaining the electrical resistivity trend of composites with nanostructures

Jinyoung Hwang, Jungmin Lee, Yesol Yun, Sang Hyun Lee, Sung Hoon Park

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Theoretical models for 1-D nanowire networks with particulate fillers are provided to explain how the electrical conductivity increases or decrease with respect to the shape and dimension of the particulate filler. The present research aims at a comprehensive understanding of the size effect of secondary particulate fillers on the electrical conductivity of CNT polymer composites. The change of the resistivity of CNT polymer composites due to the size of particulate fillers could be interpreted via the combination of Voronoi geometry induced from Swiss cheese models and underlying fiber percolation theory. This indicates that there is the transition of phases in excluded-volume effects, i.e., the enhancement in conductivity was measured in cooperation with micro-sized second fillers whereas the decrease in conductivity was observed for nano-sized fillers.

Original languageEnglish
Title of host publication2020 International Conference on Electronics, Information, and Communication, ICEIC 2020
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781728162898
DOIs
Publication statusPublished - 2020 Jan
Event2020 International Conference on Electronics, Information, and Communication, ICEIC 2020 - Barcelona, Spain
Duration: 2020 Jan 192020 Jan 22

Publication series

Name2020 International Conference on Electronics, Information, and Communication, ICEIC 2020

Conference

Conference2020 International Conference on Electronics, Information, and Communication, ICEIC 2020
CountrySpain
CityBarcelona
Period20/1/1920/1/22

Keywords

  • CNT network
  • Monte-Carlo simulation
  • Nanocomposites
  • Resistivity
  • Voronoi

ASJC Scopus subject areas

  • Computer Networks and Communications
  • Computer Science Applications
  • Hardware and Architecture
  • Information Systems and Management
  • Electrical and Electronic Engineering

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