A WR-3 Band Distributed Frequency Doubler with a Differential Quasi-cascode Structure

Iljin Lee, Younghwan Kim, Sanggeun Jeon

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This paper presents a WR-3 band distributed frequency doubler implemented in a 250-nm InP HBT technology. Three doubler unit cells are combined together with input and output transmission lines in a distributed way to achieve a wide bandwidth. A differential quasi-cascode pair is proposed for each unit cell design, which enables bandwidth extension and chip-size reduction. The distributed doubler exhibits measured peak power and conversion gain of 2.2 dBm and -6.5 dB, respectively, at 276 GHz. The doubler maintains high output power above -5 dBm from 225 to 320 GHz, which covers almost the entire WR-3 band. Due to the proposed compact distributed structure, the chip occupies only 0.23 mm including all probing pads.

Original languageEnglish
Title of host publication2019 IEEE MTT-S International Microwave Symposium, IMS 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages638-641
Number of pages4
ISBN (Electronic)9781728113098
Publication statusPublished - 2019 Jun 1
Event2019 IEEE MTT-S International Microwave Symposium, IMS 2019 - Boston, United States
Duration: 2019 Jun 22019 Jun 7

Publication series

NameIEEE MTT-S International Microwave Symposium Digest
Volume2019-June
ISSN (Print)0149-645X

Conference

Conference2019 IEEE MTT-S International Microwave Symposium, IMS 2019
CountryUnited States
CityBoston
Period19/6/219/6/7

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Keywords

  • differential quasi-cascode pair
  • Distributed structure
  • frequency doubler
  • terahertz
  • WR-3 band

ASJC Scopus subject areas

  • Radiation
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Lee, I., Kim, Y., & Jeon, S. (2019). A WR-3 Band Distributed Frequency Doubler with a Differential Quasi-cascode Structure. In 2019 IEEE MTT-S International Microwave Symposium, IMS 2019 (pp. 638-641). [8701029] (IEEE MTT-S International Microwave Symposium Digest; Vol. 2019-June). Institute of Electrical and Electronics Engineers Inc..