Adhesion properties with moisture absorption between high silica loaded epoxy molding compound and leadframe

Kyeong Keun Oh, Kyoung Sik Moon, Ho Gyu Yoon, Tak Jin Moon, Je Hong Ryu, Jin Mo Kim, Jo Gyun Kim

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

Adhesion properties between alloy 42 leadframe and epoxy molding compound (EMC) filled with more than 87 wt% of silica and cured with xylok or phenol novolac (PN) were measured with moisture absorption. The EMC cured with xylok exhibited lower moisture absorption and higher adhesion strength independent of the content of silica but the adhesion strength was more rapidly decreased with moisture absorption than that of cured with PN. From the analysis of the interface between EMC and leadframe with X-ray photoelectron spectroscopy, the principal adhesive mechanism of EMC cured with xylok was thought to be the hydrogen bond, and thus the decrease of adhesion strength between EMC and leadframe was attributed to the failure of the hydrogen bond by the absorbed water. Also, the higher adhesion strength of EMC cured with xylok could be explained as the low viscosity due to the hydrogen bond and the short intermolecular spacing with the leadframe.

Original languageEnglish
Pages (from-to)812-820
Number of pages9
JournalPolymer (Korea)
Volume21
Issue number5
Publication statusPublished - 1997

Keywords

  • Adhesion strength
  • Curing agent
  • EMC(epoxy molding compound)
  • Moisture absorption
  • X-ray photoelectron spectroscopy

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Polymers and Plastics
  • Materials Chemistry

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