Advanced yield strength of interconnector ribbon for photovoltaic module using crystallographic texture control

Byungjun Kang, Nochang Park, Sung Ju Tark, Won Wook Oh, Sungeun Park, Young Do Kim, Haeseok Lee, Donghwan Kim

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3 Citations (Scopus)


This paper reports a study on reducing the yield strength of Cu ribbon wire used for Si solar cell interconnections in solar panels. Low yield strength Cu core should be used as the interconnector ribbon to minimize the fracture of Si solar cells during the tabbing process. We lowered the yield strength of Cu ribbon by controlling the crystallographic texture without increasing the annealing time and temperature. The crystallographic texture was controlled by lubrication in a cold rolling process. The crystallographic texture was observed by scanning electron microscopy with electron back scattered diffraction. A tensile test was performed for the comparison of the mechanical properties of Cu with and without lubrication. The average yield strength was 91.2 MPa with lubrication whereas the yield strength was 99.6 MPa without lubrication. The lower value of the lubricated samples seemed to be caused by the higher cube texture intensity than that of the samples without lubrication.

Original languageEnglish
Pages (from-to)229-232
Number of pages4
JournalMetals and Materials International
Issue number2
Publication statusPublished - 2014 Jan 1



  • electron backscattering diffraction
  • solar cell
  • tensile test
  • texture
  • yield phenomena

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Metals and Alloys
  • Mechanics of Materials
  • Materials Chemistry

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