Air-stable silver-coated copper particles of sub-micrometer size

D. S. Jung, H. M. Lee, Yun Chan Kang, S. B. Park

Research output: Contribution to journalArticle

33 Citations (Scopus)

Abstract

Silver-coated copper particles with various silver loading were prepared by a direct liquid-to-particle conversion process in spray pyrolysis reactor system. The prepared particles were completely densified at 900°C within a residence time of 2.1s and had core-shell structure, of which formation mechanism was proposed. The mean diameter of particles was 0.45μm. Copper particles of 20wt.% of silver loading were stable under air and 95% of copper remained as metallic copper even after 1month of exposure to air. This enhanced air-stability contributed to the enhanced electrical property of conductive film obtained from the coated particles. The conductive film obtained from 15wt.% of silver-coated copper particles had a sheet resistance of 1.2mΩsquare-1. This low resistance resulted from the lack of oxide layer and low sintering temperature of silver layer.

Original languageEnglish
Pages (from-to)574-581
Number of pages8
JournalJournal of Colloid and Interface Science
Volume364
Issue number2
DOIs
Publication statusPublished - 2011 Dec 15
Externally publishedYes

Fingerprint

Silver
Copper
Air
Conductive films
Spray pyrolysis
Sheet resistance
Oxides
Electric properties
Sintering
Liquids
Temperature

Keywords

  • Air-stability
  • Coating
  • Conductive film
  • Copper particles
  • Spray pyrolysis

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Biomaterials
  • Surfaces, Coatings and Films
  • Colloid and Surface Chemistry

Cite this

Air-stable silver-coated copper particles of sub-micrometer size. / Jung, D. S.; Lee, H. M.; Kang, Yun Chan; Park, S. B.

In: Journal of Colloid and Interface Science, Vol. 364, No. 2, 15.12.2011, p. 574-581.

Research output: Contribution to journalArticle

Jung, D. S. ; Lee, H. M. ; Kang, Yun Chan ; Park, S. B. / Air-stable silver-coated copper particles of sub-micrometer size. In: Journal of Colloid and Interface Science. 2011 ; Vol. 364, No. 2. pp. 574-581.
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