Al 2O 3-nanodiamond composite coatings with high durability and hydrophobicity prepared by aerosol deposition

Won Hee Lee, Hyung Jun Kim, Dong Won Lee, Min Goon Jeong, Dae-Soon Lim, Song Min Nam

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11 Citations (Scopus)

Abstract

We attempted the room-temperature fabrication of Al 2O 3-based nanodiamond (ND) composite coating films on glass substrates by an aerosol deposition (AD) process to improve the anti-scratch and anti-smudge properties of the films. Submicron Al 2O 3 powder capable of fabricating transparent hard coating films was used as a base material for the starting powders, and ND treated by 1H,1H,2H,2H-perfluorooctyltriethoxysilane (PFOTES) was added to the Al 2O 3 to increase the hydrophobicity and anti-wear properties. The ND powder treated by PFOTES was mixed with the Al 2O 3 powder by ball milling to ratios of 0.01wt.%, 0.03wt.%, and 0.05wt.% ND. The water contact angle (CA) of the Al 2O 3-ND composite coating films was increased as the ND ratio increased, and the maximum water CA among all the films was 110°. In contrast to the water CA, the Al 2O 3-ND composite coating films showed low transmittance values of below 50% at a wavelength of 550nm due to the strong agglomeration of ND. To prevent the agglomeration of ND, the starting powders were mixed by attrition milling. As a result, Al 2O 3-ND composite coating films were produced that showed high transmittance values of close to 80%, even though the starting powder included 1.0wt.% ND. In addition, the Al 2O 3-ND composite coating films had a high water CA of 109° and superior anti-wear properties compared to those of glass substrates.

Original languageEnglish
Pages (from-to)4679-4684
Number of pages6
JournalSurface and Coatings Technology
Volume206
Issue number22
DOIs
Publication statusPublished - 2012 Jun 25

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Keywords

  • Aerosol deposition
  • Al O
  • Durability
  • Hydrophobicity
  • Nanodiamond

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Materials Chemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

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