A reliable antifuse scheme has been very hard to build, which has precluded its implementation in DRAM products. We devised a very reliable multi-cell structure to cope with the large process variation in the DRAM-cell-capacitor type antifuse system. The programming current did not rise above 564 μA even in the nine-cell case. The cumulative distribution of the successful rupture in the multi-cell structure could be curtailed dramatically to less than 15% of the single-cell's case and the recovery problem of programmed cells after the thermal stress (300°C) had disappeared. In addition, we also presented a Post-Package Repair (PPR) scheme that could be directly coupled to the external high-voltage power rail via an additional pin with small protection circuits, saving the chip area otherwise consumed by the internal pump circuitry. A 1 Gbit DDR SDRAMwas fabricated using Samsung's advanced 50 nm DRAM technology, successfully proving the feasibility of the proposed antifuse system implemented in it.
- Post-package repair
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials