Analysis of two-dimensional coupling efficiency for rear-facet emission in compact light emitting device packaging

Jae Ho Han, Zail Lhee

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

We exploited the coupling efficiency between a rear-facet emission of a light emitting device and a monitoring photo detector (mPD) in a transistor-outlined (TO) package. By considering the far-field angles of the back illuminating light and the detector area, we could achieve two-dimensional tolerance of the coupling efficiency in the compact microelectronic package under mechanical limitation.

Original languageEnglish
Pages (from-to)467-470
Number of pages4
JournalOptik
Volume121
Issue number5
DOIs
Publication statusPublished - 2010 Mar 1
Externally publishedYes

Fingerprint

packaging
flat surfaces
Packaging
Detectors
detectors
microelectronics
Microelectronics
illuminating
far fields
Transistors
transistors
Monitoring

Keywords

  • Far fields
  • Laser diode
  • Packaging
  • Photodiode

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics

Cite this

Analysis of two-dimensional coupling efficiency for rear-facet emission in compact light emitting device packaging. / Han, Jae Ho; Lhee, Zail.

In: Optik, Vol. 121, No. 5, 01.03.2010, p. 467-470.

Research output: Contribution to journalArticle

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