Abstract
We exploited the coupling efficiency between a rear-facet emission of a light emitting device and a monitoring photo detector (mPD) in a transistor-outlined (TO) package. By considering the far-field angles of the back illuminating light and the detector area, we could achieve two-dimensional tolerance of the coupling efficiency in the compact microelectronic package under mechanical limitation.
| Original language | English |
|---|---|
| Pages (from-to) | 467-470 |
| Number of pages | 4 |
| Journal | Optik |
| Volume | 121 |
| Issue number | 5 |
| DOIs | |
| Publication status | Published - 2010 Mar 1 |
| Externally published | Yes |
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Keywords
- Far fields
- Laser diode
- Packaging
- Photodiode
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
Cite this
Analysis of two-dimensional coupling efficiency for rear-facet emission in compact light emitting device packaging. / Han, Jae Ho; Lhee, Zail.
In: Optik, Vol. 121, No. 5, 01.03.2010, p. 467-470.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Analysis of two-dimensional coupling efficiency for rear-facet emission in compact light emitting device packaging
AU - Han, Jae Ho
AU - Lhee, Zail
PY - 2010/3/1
Y1 - 2010/3/1
N2 - We exploited the coupling efficiency between a rear-facet emission of a light emitting device and a monitoring photo detector (mPD) in a transistor-outlined (TO) package. By considering the far-field angles of the back illuminating light and the detector area, we could achieve two-dimensional tolerance of the coupling efficiency in the compact microelectronic package under mechanical limitation.
AB - We exploited the coupling efficiency between a rear-facet emission of a light emitting device and a monitoring photo detector (mPD) in a transistor-outlined (TO) package. By considering the far-field angles of the back illuminating light and the detector area, we could achieve two-dimensional tolerance of the coupling efficiency in the compact microelectronic package under mechanical limitation.
KW - Far fields
KW - Laser diode
KW - Packaging
KW - Photodiode
UR - http://www.scopus.com/inward/record.url?scp=77549084323&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=77549084323&partnerID=8YFLogxK
U2 - 10.1016/j.ijleo.2008.08.005
DO - 10.1016/j.ijleo.2008.08.005
M3 - Article
VL - 121
SP - 467
EP - 470
JO - Optik
JF - Optik
SN - 0030-4026
IS - 5
ER -