Analysis of two-dimensional coupling efficiency for rear-facet emission in compact light emitting device packaging

Jae Ho Han; Zail Lhee

doi:10.1016/j.ijleo.2008.08.005

Analysis of two-dimensional coupling efficiency for rear-facet emission in compact light emitting device packaging

Jae Ho Han, Zail Lhee

Research output: Contribution to journal › Article

2 Citations (Scopus)

Abstract

We exploited the coupling efficiency between a rear-facet emission of a light emitting device and a monitoring photo detector (mPD) in a transistor-outlined (TO) package. By considering the far-field angles of the back illuminating light and the detector area, we could achieve two-dimensional tolerance of the coupling efficiency in the compact microelectronic package under mechanical limitation.

Original language	English
Pages (from-to)	467-470
Number of pages	4
Journal	Optik
Volume	121
Issue number	5
DOIs	https://doi.org/10.1016/j.ijleo.2008.08.005
Publication status	Published - 2010 Mar

Keywords

Far fields
Laser diode
Packaging
Photodiode

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Electrical and Electronic Engineering

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10.1016/j.ijleo.2008.08.005

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Han, J. H., & Lhee, Z. (2010). Analysis of two-dimensional coupling efficiency for rear-facet emission in compact light emitting device packaging. Optik, 121(5), 467-470. https://doi.org/10.1016/j.ijleo.2008.08.005

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abstract = "We exploited the coupling efficiency between a rear-facet emission of a light emitting device and a monitoring photo detector (mPD) in a transistor-outlined (TO) package. By considering the far-field angles of the back illuminating light and the detector area, we could achieve two-dimensional tolerance of the coupling efficiency in the compact microelectronic package under mechanical limitation.",

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KW - Laser diode

KW - Packaging

KW - Photodiode

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