Analysis of two-dimensional coupling efficiency for rear-facet emission in compact light emitting device packaging

Jae Ho Han; Zail Lhee

doi:10.1016/j.ijleo.2008.08.005

Analysis of two-dimensional coupling efficiency for rear-facet emission in compact light emitting device packaging

Jae Ho Han, Zail Lhee

Research output: Contribution to journal › Article › peer-review

2 Citations (Scopus)

Abstract

We exploited the coupling efficiency between a rear-facet emission of a light emitting device and a monitoring photo detector (mPD) in a transistor-outlined (TO) package. By considering the far-field angles of the back illuminating light and the detector area, we could achieve two-dimensional tolerance of the coupling efficiency in the compact microelectronic package under mechanical limitation.

Original language	English
Pages (from-to)	467-470
Number of pages	4
Journal	Optik
Volume	121
Issue number	5
DOIs	https://doi.org/10.1016/j.ijleo.2008.08.005
Publication status	Published - 2010 Mar
Externally published	Yes

Keywords

Far fields
Laser diode
Packaging
Photodiode

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics
Electrical and Electronic Engineering

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abstract = "We exploited the coupling efficiency between a rear-facet emission of a light emitting device and a monitoring photo detector (mPD) in a transistor-outlined (TO) package. By considering the far-field angles of the back illuminating light and the detector area, we could achieve two-dimensional tolerance of the coupling efficiency in the compact microelectronic package under mechanical limitation.",

keywords = "Far fields, Laser diode, Packaging, Photodiode",

author = "Han, {Jae Ho} and Zail Lhee",

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AU - Han, Jae Ho

AU - Lhee, Zail

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N2 - We exploited the coupling efficiency between a rear-facet emission of a light emitting device and a monitoring photo detector (mPD) in a transistor-outlined (TO) package. By considering the far-field angles of the back illuminating light and the detector area, we could achieve two-dimensional tolerance of the coupling efficiency in the compact microelectronic package under mechanical limitation.

AB - We exploited the coupling efficiency between a rear-facet emission of a light emitting device and a monitoring photo detector (mPD) in a transistor-outlined (TO) package. By considering the far-field angles of the back illuminating light and the detector area, we could achieve two-dimensional tolerance of the coupling efficiency in the compact microelectronic package under mechanical limitation.

KW - Far fields

KW - Laser diode

KW - Packaging

KW - Photodiode

UR - http://www.scopus.com/inward/record.url?scp=77549084323&partnerID=8YFLogxK

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DO - 10.1016/j.ijleo.2008.08.005

M3 - Article

AN - SCOPUS:77549084323

VL - 121

SP - 467

EP - 470

JO - Optik

JF - Optik

SN - 0030-4026

IS - 5

ER -

Analysis of two-dimensional coupling efficiency for rear-facet emission in compact light emitting device packaging

Abstract

Keywords

ASJC Scopus subject areas

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