Application of electrostatic bonding to field emission display vacuum packaging

Duck Jung Lee; Nam Yang Lee; Sung Jae Jung; Kwan Su Kim; Yun Hi Lee; Jin Jang; Byeong Kwon Ju

doi:10.1149/1.1393541

Application of electrostatic bonding to field emission display vacuum packaging

Duck Jung Lee, Nam Yang Lee, Sung Jae Jung, Kwan Su Kim, Yun Hi Lee, Jin Jang, Byeong Kwon Ju

Department of Physics

Research output: Contribution to journal › Article

3 Citations (Scopus)

Abstract

A tubeless packaging technology for field emission display (FED) devices is developed using indirect glass-to-glass electrostatic bonding with an intermediate amorphous silicon layer at a low temperature of 230°C. The glass-to-glass bonding mechanism is investigated by secondary-ion mass spectroscopy. To evaluate the vacuum sealing capability of a FED panel packaged by this method, the leak characteristics of the vacuum were examined by spinning rotor gauge for 6 months and the electron emission properties of the panel was measured continuously for different amounts of time over a 26 day period. In order to examine the effect of the removal of the exhausting tube on the enhancement of vacuum efficiency, we have calculated a theoretical vacuum level in the panel based on conductance and throughput and compared with experimental values.

Original language	English
Pages (from-to)	2385-2388
Number of pages	4
Journal	Journal of the Electrochemical Society
Volume	147
Issue number	6
DOIs	https://doi.org/10.1149/1.1393541
Publication status	Published - 2000 Jun 1

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ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Renewable Energy, Sustainability and the Environment
Surfaces, Coatings and Films
Electrochemistry
Materials Chemistry

Cite this

Lee, D. J., Lee, N. Y., Jung, S. J., Kim, K. S., Lee, Y. H., Jang, J., & Ju, B. K. (2000). Application of electrostatic bonding to field emission display vacuum packaging. Journal of the Electrochemical Society, 147(6), 2385-2388. https://doi.org/10.1149/1.1393541

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10.1149/1.1393541