Abstract
A tubeless packaging technology for field emission display (FED) devices is developed using indirect glass-to-glass electrostatic bonding with an intermediate amorphous silicon layer at a low temperature of 230°C. The glass-to-glass bonding mechanism is investigated by secondary-ion mass spectroscopy. To evaluate the vacuum sealing capability of a FED panel packaged by this method, the leak characteristics of the vacuum were examined by spinning rotor gauge for 6 months and the electron emission properties of the panel was measured continuously for different amounts of time over a 26 day period. In order to examine the effect of the removal of the exhausting tube on the enhancement of vacuum efficiency, we have calculated a theoretical vacuum level in the panel based on conductance and throughput and compared with experimental values.
| Original language | English |
|---|---|
| Pages (from-to) | 2385-2388 |
| Number of pages | 4 |
| Journal | Journal of the Electrochemical Society |
| Volume | 147 |
| Issue number | 6 |
| DOIs | |
| Publication status | Published - 2000 Jun 1 |
| Externally published | Yes |
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ASJC Scopus subject areas
- Electrochemistry
- Surfaces, Coatings and Films
- Surfaces and Interfaces
Cite this
Application of electrostatic bonding to field emission display vacuum packaging. / Lee, Duck Jung; Lee, Nam Yang; Jung, Sung J.; Kim, Kwan S.; Lee, Yun-Hi; Jang, Jin; Ju, Byeong Kwon.
In: Journal of the Electrochemical Society, Vol. 147, No. 6, 01.06.2000, p. 2385-2388.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Application of electrostatic bonding to field emission display vacuum packaging
AU - Lee, Duck Jung
AU - Lee, Nam Yang
AU - Jung, Sung J.
AU - Kim, Kwan S.
AU - Lee, Yun-Hi
AU - Jang, Jin
AU - Ju, Byeong Kwon
PY - 2000/6/1
Y1 - 2000/6/1
N2 - A tubeless packaging technology for field emission display (FED) devices is developed using indirect glass-to-glass electrostatic bonding with an intermediate amorphous silicon layer at a low temperature of 230°C. The glass-to-glass bonding mechanism is investigated by secondary-ion mass spectroscopy. To evaluate the vacuum sealing capability of a FED panel packaged by this method, the leak characteristics of the vacuum were examined by spinning rotor gauge for 6 months and the electron emission properties of the panel was measured continuously for different amounts of time over a 26 day period. In order to examine the effect of the removal of the exhausting tube on the enhancement of vacuum efficiency, we have calculated a theoretical vacuum level in the panel based on conductance and throughput and compared with experimental values.
AB - A tubeless packaging technology for field emission display (FED) devices is developed using indirect glass-to-glass electrostatic bonding with an intermediate amorphous silicon layer at a low temperature of 230°C. The glass-to-glass bonding mechanism is investigated by secondary-ion mass spectroscopy. To evaluate the vacuum sealing capability of a FED panel packaged by this method, the leak characteristics of the vacuum were examined by spinning rotor gauge for 6 months and the electron emission properties of the panel was measured continuously for different amounts of time over a 26 day period. In order to examine the effect of the removal of the exhausting tube on the enhancement of vacuum efficiency, we have calculated a theoretical vacuum level in the panel based on conductance and throughput and compared with experimental values.
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UR - http://www.scopus.com/inward/citedby.url?scp=0034207098&partnerID=8YFLogxK
U2 - 10.1149/1.1393541
DO - 10.1149/1.1393541
M3 - Article
VL - 147
SP - 2385
EP - 2388
JO - Journal of the Electrochemical Society
JF - Journal of the Electrochemical Society
SN - 0013-4651
IS - 6
ER -