Application of electrostatic bonding to field emission display vacuum packaging

Duck Jung Lee, Nam Yang Lee, Sung J. Jung, Kwan S. Kim, Yun-Hi Lee, Jin Jang, Byeong Kwon Ju

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

A tubeless packaging technology for field emission display (FED) devices is developed using indirect glass-to-glass electrostatic bonding with an intermediate amorphous silicon layer at a low temperature of 230°C. The glass-to-glass bonding mechanism is investigated by secondary-ion mass spectroscopy. To evaluate the vacuum sealing capability of a FED panel packaged by this method, the leak characteristics of the vacuum were examined by spinning rotor gauge for 6 months and the electron emission properties of the panel was measured continuously for different amounts of time over a 26 day period. In order to examine the effect of the removal of the exhausting tube on the enhancement of vacuum efficiency, we have calculated a theoretical vacuum level in the panel based on conductance and throughput and compared with experimental values.

Original languageEnglish
Pages (from-to)2385-2388
Number of pages4
JournalJournal of the Electrochemical Society
Volume147
Issue number6
DOIs
Publication statusPublished - 2000 Jun 1
Externally publishedYes

Fingerprint

electrostatic bonding
Field emission displays
packaging
field emission
Electrostatics
Packaging
Vacuum
vacuum
glass
Glass
Glass bonding
exhausting
Electron emission
sealing
display devices
Amorphous silicon
electron emission
metal spinning
rotors
Gages

ASJC Scopus subject areas

  • Electrochemistry
  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

Cite this

Application of electrostatic bonding to field emission display vacuum packaging. / Lee, Duck Jung; Lee, Nam Yang; Jung, Sung J.; Kim, Kwan S.; Lee, Yun-Hi; Jang, Jin; Ju, Byeong Kwon.

In: Journal of the Electrochemical Society, Vol. 147, No. 6, 01.06.2000, p. 2385-2388.

Research output: Contribution to journalArticle

Lee, Duck Jung ; Lee, Nam Yang ; Jung, Sung J. ; Kim, Kwan S. ; Lee, Yun-Hi ; Jang, Jin ; Ju, Byeong Kwon. / Application of electrostatic bonding to field emission display vacuum packaging. In: Journal of the Electrochemical Society. 2000 ; Vol. 147, No. 6. pp. 2385-2388.
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