Assembly and interconnection technology for micromechanical structures using anisotropic conductive film

In Byeong Kang, Malcolm R. Haskard, Byeong Kwon Ju

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

A bonding method using an anisotropic conductive film (ACF) has been developed for the assembly and interconnection of micromechanical structures. The method provides many advantages such as low temperature, low cost, process simplicity, selective bonding as well as both electrical and mechanical interconnection. These advantages were confirmed by experiment using CP7621. ACF on various materials such as wafers, glasses, thin metal layers, and plastic films. For the experiments, a range of materials were tested including p type, (100) orientation, 100 ohm-cm resistivity, 300 micrometers thickness silicon wafers with/without micromechanical structures, 300 micrometers thick sodalime glass substrates, 1.5 mm thick pyrex glass substrates, and 100 micrometers polyethylene plastic thin film were used to verify the effectiveness of this bonding method. A 2000 angstrom thick sputtered aluminium and chrome layer was also used to confirm the electrical interconnection between conductors. The optimum bonding conditions were achieved at 180 degrees C temperature with 5 kg/cm 2 pressure applied for 10 seconds. Cleaning was not over critical for the process and the bond strength was strong on silicon and glass substrates. The process was applied to fabricate a silicon micropump that consists of three wafers, results indicating excellent sealing and stability characteristics both needed for this application.

Original languageEnglish
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
EditorsStella W. Pang, Shih-Chia Chang
Pages280-287
Number of pages8
Volume2879
Publication statusPublished - 1996 Dec 1
Externally publishedYes
EventMicromachining and Microfabrication Process Technology II - Austin, TX, USA
Duration: 1996 Oct 141996 Oct 15

Other

OtherMicromachining and Microfabrication Process Technology II
CityAustin, TX, USA
Period96/10/1496/10/15

Fingerprint

Conductive films
Glass
Plastic films
Substrates
Silicon
Bond strength (materials)
Silicon wafers
Polyethylenes
Cleaning
Experiments
Aluminum
Thin films
Temperature
Metals
Costs

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Kang, I. B., Haskard, M. R., & Ju, B. K. (1996). Assembly and interconnection technology for micromechanical structures using anisotropic conductive film. In S. W. Pang, & S-C. Chang (Eds.), Proceedings of SPIE - The International Society for Optical Engineering (Vol. 2879, pp. 280-287)

Assembly and interconnection technology for micromechanical structures using anisotropic conductive film. / Kang, In Byeong; Haskard, Malcolm R.; Ju, Byeong Kwon.

Proceedings of SPIE - The International Society for Optical Engineering. ed. / Stella W. Pang; Shih-Chia Chang. Vol. 2879 1996. p. 280-287.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kang, IB, Haskard, MR & Ju, BK 1996, Assembly and interconnection technology for micromechanical structures using anisotropic conductive film. in SW Pang & S-C Chang (eds), Proceedings of SPIE - The International Society for Optical Engineering. vol. 2879, pp. 280-287, Micromachining and Microfabrication Process Technology II, Austin, TX, USA, 96/10/14.
Kang IB, Haskard MR, Ju BK. Assembly and interconnection technology for micromechanical structures using anisotropic conductive film. In Pang SW, Chang S-C, editors, Proceedings of SPIE - The International Society for Optical Engineering. Vol. 2879. 1996. p. 280-287
Kang, In Byeong ; Haskard, Malcolm R. ; Ju, Byeong Kwon. / Assembly and interconnection technology for micromechanical structures using anisotropic conductive film. Proceedings of SPIE - The International Society for Optical Engineering. editor / Stella W. Pang ; Shih-Chia Chang. Vol. 2879 1996. pp. 280-287
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