Auto-masked surface texturing of kerf-loss free silicon wafers using hexafluoroisopropanol in a capacitively coupled plasma etching system

Suhyun Kim, Jin Su Park, Jun Hyun Kim, Chang Koo Kim, Ji Hyun Kim

Research output: Contribution to journalArticle

Abstract

As the solar cell industry grows and receives worldwide attention for its sustainability, the consideration for its environmental impact becomes inevitable. The high global warming potential (GWP) of the fluorinated gases commonly used in a plasma processing is a significant environmental issue that needs to be addressed. Substituting the high GWP etchants with alternative gases could be an effective solution in plasma etching. Hexafluoroisopropanol (HFIP) not only has relatively low GWP and short atmospheric lifetime, but is also suitable for forming dense nanostructures on the silicon substrate. The morphology of the nanostructures fabricated on kerf-loss free (KLF) silicon substrates was changed by controlling the DC bias voltage of the capacitively coupled plasma etching system. The resulting reflectance spectra shows that HFIP/O2 plasma etching is highly effective in reducing the optical reflectivity loss of the silicon wafers. The suggested dry processing of KLF silicon wafers could improve both industrial and environmental sustainability of solar cell production.

Original languageEnglish
Pages (from-to)Q76-Q79
JournalECS Journal of Solid State Science and Technology
Volume8
Issue number4
DOIs
Publication statusPublished - 2019 Jan 1

Fingerprint

Plasma etching
Texturing
Global warming
Silicon wafers
Silicon
Sustainable development
Nanostructures
Solar cells
Gases
Plasma applications
Substrates
Bias voltage
Environmental impact
Processing
hexafluoroisopropanol
Industry

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Auto-masked surface texturing of kerf-loss free silicon wafers using hexafluoroisopropanol in a capacitively coupled plasma etching system. / Kim, Suhyun; Park, Jin Su; Kim, Jun Hyun; Kim, Chang Koo; Kim, Ji Hyun.

In: ECS Journal of Solid State Science and Technology, Vol. 8, No. 4, 01.01.2019, p. Q76-Q79.

Research output: Contribution to journalArticle

@article{f1c4887383bc430d935339bcba2dadf0,
title = "Auto-masked surface texturing of kerf-loss free silicon wafers using hexafluoroisopropanol in a capacitively coupled plasma etching system",
abstract = "As the solar cell industry grows and receives worldwide attention for its sustainability, the consideration for its environmental impact becomes inevitable. The high global warming potential (GWP) of the fluorinated gases commonly used in a plasma processing is a significant environmental issue that needs to be addressed. Substituting the high GWP etchants with alternative gases could be an effective solution in plasma etching. Hexafluoroisopropanol (HFIP) not only has relatively low GWP and short atmospheric lifetime, but is also suitable for forming dense nanostructures on the silicon substrate. The morphology of the nanostructures fabricated on kerf-loss free (KLF) silicon substrates was changed by controlling the DC bias voltage of the capacitively coupled plasma etching system. The resulting reflectance spectra shows that HFIP/O2 plasma etching is highly effective in reducing the optical reflectivity loss of the silicon wafers. The suggested dry processing of KLF silicon wafers could improve both industrial and environmental sustainability of solar cell production.",
author = "Suhyun Kim and Park, {Jin Su} and Kim, {Jun Hyun} and Kim, {Chang Koo} and Kim, {Ji Hyun}",
year = "2019",
month = "1",
day = "1",
doi = "10.1149/2.0091904jss",
language = "English",
volume = "8",
pages = "Q76--Q79",
journal = "ECS Journal of Solid State Science and Technology",
issn = "2162-8769",
publisher = "Electrochemical Society, Inc.",
number = "4",

}

TY - JOUR

T1 - Auto-masked surface texturing of kerf-loss free silicon wafers using hexafluoroisopropanol in a capacitively coupled plasma etching system

AU - Kim, Suhyun

AU - Park, Jin Su

AU - Kim, Jun Hyun

AU - Kim, Chang Koo

AU - Kim, Ji Hyun

PY - 2019/1/1

Y1 - 2019/1/1

N2 - As the solar cell industry grows and receives worldwide attention for its sustainability, the consideration for its environmental impact becomes inevitable. The high global warming potential (GWP) of the fluorinated gases commonly used in a plasma processing is a significant environmental issue that needs to be addressed. Substituting the high GWP etchants with alternative gases could be an effective solution in plasma etching. Hexafluoroisopropanol (HFIP) not only has relatively low GWP and short atmospheric lifetime, but is also suitable for forming dense nanostructures on the silicon substrate. The morphology of the nanostructures fabricated on kerf-loss free (KLF) silicon substrates was changed by controlling the DC bias voltage of the capacitively coupled plasma etching system. The resulting reflectance spectra shows that HFIP/O2 plasma etching is highly effective in reducing the optical reflectivity loss of the silicon wafers. The suggested dry processing of KLF silicon wafers could improve both industrial and environmental sustainability of solar cell production.

AB - As the solar cell industry grows and receives worldwide attention for its sustainability, the consideration for its environmental impact becomes inevitable. The high global warming potential (GWP) of the fluorinated gases commonly used in a plasma processing is a significant environmental issue that needs to be addressed. Substituting the high GWP etchants with alternative gases could be an effective solution in plasma etching. Hexafluoroisopropanol (HFIP) not only has relatively low GWP and short atmospheric lifetime, but is also suitable for forming dense nanostructures on the silicon substrate. The morphology of the nanostructures fabricated on kerf-loss free (KLF) silicon substrates was changed by controlling the DC bias voltage of the capacitively coupled plasma etching system. The resulting reflectance spectra shows that HFIP/O2 plasma etching is highly effective in reducing the optical reflectivity loss of the silicon wafers. The suggested dry processing of KLF silicon wafers could improve both industrial and environmental sustainability of solar cell production.

UR - http://www.scopus.com/inward/record.url?scp=85072039716&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85072039716&partnerID=8YFLogxK

U2 - 10.1149/2.0091904jss

DO - 10.1149/2.0091904jss

M3 - Article

VL - 8

SP - Q76-Q79

JO - ECS Journal of Solid State Science and Technology

JF - ECS Journal of Solid State Science and Technology

SN - 2162-8769

IS - 4

ER -