Binary hybrid filler composite formulations of surface modified Fe–Si–Al alloys for multifunctional EMI shielding and thermal conduction

Seohyun Noh, Junpyo Hong, Sun Yong Choi, Jongok Won, Ho Gyu Yoon, Chong Min Koo, Albert S. Lee, Seung Sang Hwang

Research output: Contribution to journalArticlepeer-review

Abstract

Sendust/expanded graphite and Sendust/boron nitride binary composite fillers adhered through surface silane modification and their non-modified, simply mixed, polymer composites were fabricated for optimization of multifunctional EMI shielding and thermal conduction properties. The effect of filler type, filler content, surface modification, and dispersion properties in thermoplastic polyurethane matrix were examined. Through extensive screening of hybrid composite compositions, tunable properties in EMI shielding (2.8–32.1 dB at 3 GHz and 7.6–48 dB at 10 GHz, sample thickness 0.6 mm), through-plane thermal conductivity (0.3–1.694 W/mK), and in-plane thermal conductivity 1.102–6.084 W/mK) were elucidated through electrical conductivity measurements and dispersion morphology within the polymer matrix. The composite materials database reported in this study allows for the selection of customizable properties according to desired application.

Original languageEnglish
Article number126024
JournalMaterials Chemistry and Physics
Volume284
DOIs
Publication statusPublished - 2022 May 15

Keywords

  • Binary fillers
  • EMI shielding
  • Sendust flake
  • Surface-modified composites
  • Thermal conductivity

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics

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