Capillary pumped loop heat spreader for electronics cooling

Jaewon Chung, Costas P. Grigoropoulos, Ralph Greif

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

As cooling requirements for electronic devices, e.g. computer processor units, power modules, etc. increase beyond the capabilities of air-cooling, interest has moved to several alternatives such as thermoelectric coolers, impinging jets and heat exchangers with phase change. Included among these, the capillary pumped loop is a very competitive cooling device, because of its performance reliability, no power requirements and low manufacturing cost. In this paper, a heat spreader employing capillary pumped loop principles was made of aluminum and copper and tested. The copper CPL heat spreader with heat sinks and fans on the condenser (86mm thick, 60mm wide, 181mm long) has demonstrated a cooling capacity of 640W at atmospheric pressure in the vertical orientation and maintains a difference between T IHE (temperature of the interface between heater and evaporator) and T AME (ambient temperature) lower than 100°C.

Original languageEnglish
Title of host publicationAmerican Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
EditorsY. Jaluria
Pages283-290
Number of pages8
Volume369
Edition7
Publication statusPublished - 2001
Externally publishedYes
Event2001 ASME International Mechanical Engineering Congress and Exposition - New York, NY, United States
Duration: 2001 Nov 112001 Nov 16

Other

Other2001 ASME International Mechanical Engineering Congress and Exposition
CountryUnited States
CityNew York, NY
Period01/11/1101/11/16

Fingerprint

Electronic cooling
Spreaders
Cooling
Copper
Condensers (liquefiers)
Heat sinks
Evaporators
Aluminum
Fans
Atmospheric pressure
Heat exchangers
Temperature
Hot Temperature
Air
Costs

Keywords

  • Capillary pumped loop
  • CPU
  • Heat spreader
  • IGBT
  • Phase change
  • Porous sheet
  • Thermal management

ASJC Scopus subject areas

  • Fluid Flow and Transfer Processes
  • Mechanical Engineering

Cite this

Chung, J., Grigoropoulos, C. P., & Greif, R. (2001). Capillary pumped loop heat spreader for electronics cooling. In Y. Jaluria (Ed.), American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD (7 ed., Vol. 369, pp. 283-290)

Capillary pumped loop heat spreader for electronics cooling. / Chung, Jaewon; Grigoropoulos, Costas P.; Greif, Ralph.

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD. ed. / Y. Jaluria. Vol. 369 7. ed. 2001. p. 283-290.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Chung, J, Grigoropoulos, CP & Greif, R 2001, Capillary pumped loop heat spreader for electronics cooling. in Y Jaluria (ed.), American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD. 7 edn, vol. 369, pp. 283-290, 2001 ASME International Mechanical Engineering Congress and Exposition, New York, NY, United States, 01/11/11.
Chung J, Grigoropoulos CP, Greif R. Capillary pumped loop heat spreader for electronics cooling. In Jaluria Y, editor, American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD. 7 ed. Vol. 369. 2001. p. 283-290
Chung, Jaewon ; Grigoropoulos, Costas P. ; Greif, Ralph. / Capillary pumped loop heat spreader for electronics cooling. American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD. editor / Y. Jaluria. Vol. 369 7. ed. 2001. pp. 283-290
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