We demonstrate that structure engineering of the transmission line near the via can reduce the amount of reflection of the RF signal. We have fabricated two types of vias with different transmission line geometries and have measured the reflection. The measured results show that the shape of the transmission line near the via hole is important in determining the total reflection of the via structure. The amount of reflection obtained from full three-dimensional (3-D) electromagnetic simulations can reproduce the measured results with reasonable accuracy, which suggest that efficient design of the via structure could be possible without resorting to hardware fabrication and characterization.
|Number of pages||7|
|Journal||IEEE Transactions on Components and Packaging Technologies|
|Publication status||Published - 2003 Jun|
- Electromagnetic simulation
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering