Characterization and modeling of a new via structure in multilayered printed circuit boards

Dae Han Kwon; Jaewon Kim; Ki Hyuk Kim; Seung Chul Choi; Ju Hwan Lim; Jung Ho Park; Lynn Choi; Sung Woo Hwang; Seung Hee Lee

doi:10.1109/TCAPT.2003.815119

Characterization and modeling of a new via structure in multilayered printed circuit boards

Dae Han Kwon, Jaewon Kim, Ki Hyuk Kim, Seung Chul Choi, Ju Hwan Lim, Jung Ho Park, Lynn Choi, Sung Woo Hwang, Seung Hee Lee

School of Electrical Engineering

Research output: Contribution to journal › Article › peer-review

20 Citations (Scopus)

Abstract

We demonstrate that structure engineering of the transmission line near the via can reduce the amount of reflection of the RF signal. We have fabricated two types of vias with different transmission line geometries and have measured the reflection. The measured results show that the shape of the transmission line near the via hole is important in determining the total reflection of the via structure. The amount of reflection obtained from full three-dimensional (3-D) electromagnetic simulations can reproduce the measured results with reasonable accuracy, which suggest that efficient design of the via structure could be possible without resorting to hardware fabrication and characterization.

Original language	English
Pages (from-to)	483-489
Number of pages	7
Journal	IEEE Transactions on Components and Packaging Technologies
Volume	26
Issue number	2
DOIs	https://doi.org/10.1109/TCAPT.2003.815119
Publication status	Published - 2003 Jun

Keywords

Electromagnetic simulation
PCB
RF
Via

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Access to Document

10.1109/TCAPT.2003.815119

Cite this

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title = "Characterization and modeling of a new via structure in multilayered printed circuit boards",

abstract = "We demonstrate that structure engineering of the transmission line near the via can reduce the amount of reflection of the RF signal. We have fabricated two types of vias with different transmission line geometries and have measured the reflection. The measured results show that the shape of the transmission line near the via hole is important in determining the total reflection of the via structure. The amount of reflection obtained from full three-dimensional (3-D) electromagnetic simulations can reproduce the measured results with reasonable accuracy, which suggest that efficient design of the via structure could be possible without resorting to hardware fabrication and characterization.",

keywords = "Electromagnetic simulation, PCB, RF, Via",

author = "Kwon, {Dae Han} and Jaewon Kim and Kim, {Ki Hyuk} and Choi, {Seung Chul} and Lim, {Ju Hwan} and Park, {Jung Ho} and Lynn Choi and Hwang, {Sung Woo} and Lee, {Seung Hee}",

note = "Funding Information: Manuscript received August 21, 2001; revised March 16, 2003. This work was supported by the Brain Korea 21 Project in 2002 and Small and Medium Enterprises Universities Research Institutes Consortium Project of SMBA (Small and Medium Business Administration). This work was recommended for publication by Associate Editor A. Deutsch upon evaluation of the reviewers{\textquoteright} comments.",

year = "2003",

month = jun,

doi = "10.1109/TCAPT.2003.815119",

language = "English",

volume = "26",

pages = "483--489",

journal = "IEEE Transactions on Components and Packaging Technologies",

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AU - Kwon, Dae Han

AU - Kim, Jaewon

AU - Kim, Ki Hyuk

AU - Choi, Seung Chul

AU - Lim, Ju Hwan

AU - Park, Jung Ho

AU - Choi, Lynn

AU - Hwang, Sung Woo

AU - Lee, Seung Hee

N1 - Funding Information: Manuscript received August 21, 2001; revised March 16, 2003. This work was supported by the Brain Korea 21 Project in 2002 and Small and Medium Enterprises Universities Research Institutes Consortium Project of SMBA (Small and Medium Business Administration). This work was recommended for publication by Associate Editor A. Deutsch upon evaluation of the reviewers’ comments.

PY - 2003/6

Y1 - 2003/6

N2 - We demonstrate that structure engineering of the transmission line near the via can reduce the amount of reflection of the RF signal. We have fabricated two types of vias with different transmission line geometries and have measured the reflection. The measured results show that the shape of the transmission line near the via hole is important in determining the total reflection of the via structure. The amount of reflection obtained from full three-dimensional (3-D) electromagnetic simulations can reproduce the measured results with reasonable accuracy, which suggest that efficient design of the via structure could be possible without resorting to hardware fabrication and characterization.

AB - We demonstrate that structure engineering of the transmission line near the via can reduce the amount of reflection of the RF signal. We have fabricated two types of vias with different transmission line geometries and have measured the reflection. The measured results show that the shape of the transmission line near the via hole is important in determining the total reflection of the via structure. The amount of reflection obtained from full three-dimensional (3-D) electromagnetic simulations can reproduce the measured results with reasonable accuracy, which suggest that efficient design of the via structure could be possible without resorting to hardware fabrication and characterization.

KW - Electromagnetic simulation

KW - PCB

KW - RF

KW - Via

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DO - 10.1109/TCAPT.2003.815119

M3 - Article

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SN - 1521-3331

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EP - 489

JO - IEEE Transactions on Components and Packaging Technologies

JF - IEEE Transactions on Components and Packaging Technologies

IS - 2

ER -

Characterization and modeling of a new via structure in multilayered printed circuit boards

Abstract

Keywords

ASJC Scopus subject areas

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