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Characterization and modeling of a new via structure in multilayered printed circuit boards
Dae Han Kwon, Jaewon Kim, Ki Hyuk Kim, Seung Chul Choi, Ju Hwan Lim, Jung Ho Park, Lynn Choi, Sung Woo Hwang, Seung Hee Lee
Research output: Contribution to journal › Article › peer-review
20
Citations
(Scopus)