Characterization and modeling of a new via structure in multilayered printed circuit boards

Dae Han Kwon, Jaewon Kim, Ki Hyuk Kim, Seung Chul Choi, Ju Hwan Lim, Jung Ho Park, Lynn Choi, Sung Woo Hwang, Seung Hee Lee

Research output: Contribution to journalArticlepeer-review

20 Citations (Scopus)

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Chemical Compounds

Engineering & Materials Science