Characterization of etch resistance property of imprinting resin

Seon Yong Hwang, Ho Yong Jung, Ki Yeon Yang, Jun Ho Jeong, Kyung Woo Choi, Heon Lee

Research output: Contribution to journalArticle

11 Citations (Scopus)

Abstract

Nanoimprint lithography has been intensively researched since it can fabricate nano-scale patterns on large area substrates. Thermal nanoimprinting, using a monomer-based resist has gained more interest due to its shorter process time and lower process temperature, compared to the conventional hot embossing process. A near-zero residual layer imprint process can also be done using monomer-based imprint resin, due to its low viscosity. However, the poor etch resistance of monomer-based imprint resin limits its possible applications. In this study, Methacryloxypropyl terminated Poly-Dimethylsiloxanes material was added to a monomer-based thermal imprint resin, and its effect on etch resistance and imprintability was investigated.

Original languageEnglish
Pages (from-to)141-145
Number of pages5
JournalElectronic Materials Letters
Volume4
Issue number3
Publication statusPublished - 2008 Dec 1

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Keywords

  • Benzylmethacrylate
  • Bi-layer imprint
  • Etch resistance
  • Imprint resin
  • M-PDMS (methacryloxypropyl terminated poly-dimethylsiloxanes)
  • Nanoimprint lithography

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Hwang, S. Y., Jung, H. Y., Yang, K. Y., Jeong, J. H., Choi, K. W., & Lee, H. (2008). Characterization of etch resistance property of imprinting resin. Electronic Materials Letters, 4(3), 141-145.