Abstract
Nanoimprint lithography has been intensively researched since it can fabricate nano-scale patterns on large area substrates. Thermal nanoimprinting, using a monomer-based resist has gained more interest due to its shorter process time and lower process temperature, compared to the conventional hot embossing process. A near-zero residual layer imprint process can also be done using monomer-based imprint resin, due to its low viscosity. However, the poor etch resistance of monomer-based imprint resin limits its possible applications. In this study, Methacryloxypropyl terminated Poly-Dimethylsiloxanes material was added to a monomer-based thermal imprint resin, and its effect on etch resistance and imprintability was investigated.
| Original language | English |
|---|---|
| Pages (from-to) | 141-145 |
| Number of pages | 5 |
| Journal | Electronic Materials Letters |
| Volume | 4 |
| Issue number | 3 |
| Publication status | Published - 2008 |
Keywords
- Benzylmethacrylate
- Bi-layer imprint
- Etch resistance
- Imprint resin
- M-PDMS (methacryloxypropyl terminated poly-dimethylsiloxanes)
- Nanoimprint lithography
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials