Characterization of porous Pt films deposited via sputtering

Ikwhang Chang, Seunghee Woo, Min Hwan Lee, Joon Hyung Shim, Yuanzhe Piao, Suk Won Cha

Research output: Contribution to journalArticle

25 Citations (Scopus)

Abstract

This paper investigates the effect of platinum catalyst thickness and morphology on the electrochemical surface area using electron microscopy and cyclic voltammetry. The roughness and porosity of platinum catalyst are varied by using different argon pressures during platinum sputter-deposition process. Lower argon pressure results in denser and smoother platinum films, which are confirmed by scanning electron microscopy and atomic force microscopy, respectively. The cyclic voltammetry is then used to quantify the catalytic activity of the films with various thickness and morphology. The electrochemical surface area extracted from the cyclic voltammetry shows that the current density is enhanced by 4-5 orders of magnitude through the formation of finite amount of porosity using a higher argon pressure (>60 mTorr) compared to a highly dense film.

Original languageEnglish
Pages (from-to)463-466
Number of pages4
JournalApplied Surface Science
Volume282
DOIs
Publication statusPublished - 2013 Oct 1

Fingerprint

Platinum
Sputtering
Argon
Cyclic voltammetry
Porosity
Sputter deposition
Catalysts
Electron microscopy
Atomic force microscopy
Catalyst activity
Current density
Surface roughness
Scanning electron microscopy

Keywords

  • Fuel cell
  • Platinum
  • Porosity
  • Scanning probe microscope
  • Thin film
  • Vacuum

ASJC Scopus subject areas

  • Surfaces, Coatings and Films

Cite this

Characterization of porous Pt films deposited via sputtering. / Chang, Ikwhang; Woo, Seunghee; Lee, Min Hwan; Shim, Joon Hyung; Piao, Yuanzhe; Cha, Suk Won.

In: Applied Surface Science, Vol. 282, 01.10.2013, p. 463-466.

Research output: Contribution to journalArticle

Chang, Ikwhang ; Woo, Seunghee ; Lee, Min Hwan ; Shim, Joon Hyung ; Piao, Yuanzhe ; Cha, Suk Won. / Characterization of porous Pt films deposited via sputtering. In: Applied Surface Science. 2013 ; Vol. 282. pp. 463-466.
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