Cold spray deposition of copper electrodes on silicon and glass substrates

Do Yeon Kim, Jung Jae Park, Jong Gun Lee, Donghwan Kim, Sung Ju Tark, Sejin Ahn, Jae Ho Yun, Jihye Gwak, Kyung Hoon Yoon, Sanjeev Chandra, Sam S. Yoon

Research output: Contribution to journalArticle

35 Citations (Scopus)

Abstract

Copper lines with widths varying from 150 to 1500 μm were deposited onto crystalline silicon wafers and soda-lime glass plates by cold spraying copper particles with 1 μm average diameter through a mask. This direct deposition method yielded high-aspect-ratio electrodes with minimum shadowing effects and maximum electrode-to-silicon contact area. The copper lines had triangular cross sections with aspect ratios (height/width) ranging from 0.1 to 1.1, depending on the number of spray gun passes. Copper particles were densely packed with increasing the width of the masking slit. This study presents the potential use of the cold spray technology in printing lines as front electrodes in solar cell applications.

Original languageEnglish
Pages (from-to)1092-1102
Number of pages11
JournalJournal of Thermal Spray Technology
Volume22
Issue number7
DOIs
Publication statusPublished - 2013 Oct 1

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Keywords

  • coating glass
  • cold spray
  • copper electrode
  • line printing
  • solar cell

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Materials Chemistry

Cite this

Kim, D. Y., Park, J. J., Lee, J. G., Kim, D., Tark, S. J., Ahn, S., Yun, J. H., Gwak, J., Yoon, K. H., Chandra, S., & Yoon, S. S. (2013). Cold spray deposition of copper electrodes on silicon and glass substrates. Journal of Thermal Spray Technology, 22(7), 1092-1102. https://doi.org/10.1007/s11666-013-9953-4