Contact angle evaluation for laser cleaning efficiency

J. Y. Baek; H. Jeong; M. H. Lee; J. D. Song; S. B. Kim; K. W. Lee; G. S. Kim; Sung Hyun Kim

doi:10.1049/el.2009.0569

Contact angle evaluation for laser cleaning efficiency

J. Y. Baek, H. Jeong, M. H. Lee, J. D. Song, S. B. Kim, K. W. Lee, G. S. Kim, Sung Hyun Kim

Department of Chemical and Biological Engineering

Research output: Contribution to journal › Article

1 Citation (Scopus)

Abstract

A laser cleaning technique using an excimer laser is introduced to remove the photoresist on a Si wafer surface and its cleaning characteristics have been investigated. To analyse the cleaning efficiency quantitatively, a scanning electronic microscope, energy dispersive spectroscope, surface scanner and contact angle measurement were employed. Among these methods, it was confirmed experimentally that the contact angle measurement could be applicable to analyse the laser cleaning efficiency effectively owing to its speed of measurement and low measurement cost.

Original language	English
Pages (from-to)	553-554
Number of pages	2
Journal	Electronics Letters
Volume	45
Issue number	11
DOIs	https://doi.org/10.1049/el.2009.0569
Publication status	Published - 2009 Jun 8

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ASJC Scopus subject areas

Electrical and Electronic Engineering

Cite this

Baek, J. Y., Jeong, H., Lee, M. H., Song, J. D., Kim, S. B., Lee, K. W., Kim, G. S., & Kim, S. H. (2009). Contact angle evaluation for laser cleaning efficiency. Electronics Letters, 45(11), 553-554. https://doi.org/10.1049/el.2009.0569

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10.1049/el.2009.0569