Abstract
A laser cleaning technique using an excimer laser is introduced to remove the photoresist on a Si wafer surface and its cleaning characteristics have been investigated. To analyse the cleaning efficiency quantitatively, a scanning electronic microscope, energy dispersive spectroscope, surface scanner and contact angle measurement were employed. Among these methods, it was confirmed experimentally that the contact angle measurement could be applicable to analyse the laser cleaning efficiency effectively owing to its speed of measurement and low measurement cost.
| Original language | English |
|---|---|
| Pages (from-to) | 553-554 |
| Number of pages | 2 |
| Journal | Electronics Letters |
| Volume | 45 |
| Issue number | 11 |
| DOIs | |
| Publication status | Published - 2009 Jun 8 |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
Cite this
Contact angle evaluation for laser cleaning efficiency. / Baek, J. Y.; Jeong, H.; Lee, M. H.; Song, J. D.; Kim, S. B.; Lee, K. W.; Kim, G. S.; Kim, Sung Hyun.
In: Electronics Letters, Vol. 45, No. 11, 08.06.2009, p. 553-554.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Contact angle evaluation for laser cleaning efficiency
AU - Baek, J. Y.
AU - Jeong, H.
AU - Lee, M. H.
AU - Song, J. D.
AU - Kim, S. B.
AU - Lee, K. W.
AU - Kim, G. S.
AU - Kim, Sung Hyun
PY - 2009/6/8
Y1 - 2009/6/8
N2 - A laser cleaning technique using an excimer laser is introduced to remove the photoresist on a Si wafer surface and its cleaning characteristics have been investigated. To analyse the cleaning efficiency quantitatively, a scanning electronic microscope, energy dispersive spectroscope, surface scanner and contact angle measurement were employed. Among these methods, it was confirmed experimentally that the contact angle measurement could be applicable to analyse the laser cleaning efficiency effectively owing to its speed of measurement and low measurement cost.
AB - A laser cleaning technique using an excimer laser is introduced to remove the photoresist on a Si wafer surface and its cleaning characteristics have been investigated. To analyse the cleaning efficiency quantitatively, a scanning electronic microscope, energy dispersive spectroscope, surface scanner and contact angle measurement were employed. Among these methods, it was confirmed experimentally that the contact angle measurement could be applicable to analyse the laser cleaning efficiency effectively owing to its speed of measurement and low measurement cost.
UR - http://www.scopus.com/inward/record.url?scp=66249143061&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=66249143061&partnerID=8YFLogxK
U2 - 10.1049/el.2009.0569
DO - 10.1049/el.2009.0569
M3 - Article
AN - SCOPUS:66249143061
VL - 45
SP - 553
EP - 554
JO - Electronics Letters
JF - Electronics Letters
SN - 0013-5194
IS - 11
ER -