Contact printing technologies for encapsulation of flexible oleds

Hakkoo Kim, Jin Hwan Choi, Young Wook Park, Tae Hyun Park, Eun Ho Song, Se Joong Shin, Hyun Jun Lee, Byeong Kwon Ju

Research output: Contribution to journalConference article

Abstract

Contact printing is an encapsulation technique, which allows printing of UV-cured resin coated on a polymer stamp (polydimethylsiloxane, which is also known as PDMS) to different surfaces. The contact printing process allows encapsulation to be layered without using sophisticated methods and solvent effect [1]. In this paper, we present the fabrication of a new encapsulation for the flexible organic light-emitting diodes (OLESs) on a plastic substrate. Our experimental results confirmed that the encapsulation, which restricted the moisture that penetrated into the devices. This method is ideally suited to the fabrication of flexible OLEDs.

Original languageEnglish
Pages (from-to)1258-1260
Number of pages3
JournalDigest of Technical Papers - SID International Symposium
Volume43
Issue number1
DOIs
Publication statusPublished - 2012 Jan 1
Event49th SID International Symposium, Seminar and Exhibition, dubbed Display Week, 2012 - Boston, United States
Duration: 2012 Jun 32012 Jun 8

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Encapsulation
Printing
Organic light emitting diodes (OLED)
Fabrication
Polydimethylsiloxane
Moisture
Resins
Plastics
Polymers
Substrates

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Contact printing technologies for encapsulation of flexible oleds. / Kim, Hakkoo; Choi, Jin Hwan; Park, Young Wook; Park, Tae Hyun; Song, Eun Ho; Shin, Se Joong; Lee, Hyun Jun; Ju, Byeong Kwon.

In: Digest of Technical Papers - SID International Symposium, Vol. 43, No. 1, 01.01.2012, p. 1258-1260.

Research output: Contribution to journalConference article

Kim, Hakkoo ; Choi, Jin Hwan ; Park, Young Wook ; Park, Tae Hyun ; Song, Eun Ho ; Shin, Se Joong ; Lee, Hyun Jun ; Ju, Byeong Kwon. / Contact printing technologies for encapsulation of flexible oleds. In: Digest of Technical Papers - SID International Symposium. 2012 ; Vol. 43, No. 1. pp. 1258-1260.
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