Contact printing technologies for encapsulation of flexible oleds

Hakkoo Kim; Jin Hwan Choi; Young Wook Park; Tae Hyun Park; Eun Ho Song; Se Joong Shin; Hyun Jun Lee; Byeong Kwon Ju

doi:10.1002/j.2168-0159.2012.tb06027.x

Contact printing technologies for encapsulation of flexible oleds

Hakkoo Kim, Jin Hwan Choi, Young Wook Park, Tae Hyun Park, Eun Ho Song, Se Joong Shin, Hyun Jun Lee, Byeong Kwon Ju

School of Electrical Engineering

Research output: Contribution to journal › Conference article › peer-review

1 Citation (Scopus)

Abstract

Contact printing is an encapsulation technique, which allows printing of UV-cured resin coated on a polymer stamp (polydimethylsiloxane, which is also known as PDMS) to different surfaces. The contact printing process allows encapsulation to be layered without using sophisticated methods and solvent effect [1]. In this paper, we present the fabrication of a new encapsulation for the flexible organic light-emitting diodes (OLESs) on a plastic substrate. Our experimental results confirmed that the encapsulation, which restricted the moisture that penetrated into the devices. This method is ideally suited to the fabrication of flexible OLEDs.

Original language	English
Pages (from-to)	1258-1260
Number of pages	3
Journal	Digest of Technical Papers - SID International Symposium
Volume	43
Issue number	1
DOIs	https://doi.org/10.1002/j.2168-0159.2012.tb06027.x
Publication status	Published - 2012 Jan 1
Event	49th SID International Symposium, Seminar and Exhibition, dubbed Display Week, 2012 - Boston, United States Duration: 2012 Jun 3 → 2012 Jun 8

ASJC Scopus subject areas

Engineering(all)

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Contact printing technologies for encapsulation of flexible oleds. / Kim, Hakkoo; Choi, Jin Hwan; Park, Young Wook; Park, Tae Hyun; Song, Eun Ho; Shin, Se Joong; Lee, Hyun Jun; Ju, Byeong Kwon.

In: Digest of Technical Papers - SID International Symposium, Vol. 43, No. 1, 01.01.2012, p. 1258-1260.

Research output: Contribution to journal › Conference article › peer-review

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AU - Lee, Hyun Jun

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