Abstract
Contact printing is an encapsulation technique, which allows printing of UV-cured resin coated on a polymer stamp (polydimethylsiloxane, which is also known as PDMS) to different surfaces. The contact printing process allows encapsulation to be layered without using sophisticated methods and solvent effect [1]. In this paper, we present the fabrication of a new encapsulation for the flexible organic light-emitting diodes (OLESs) on a plastic substrate. Our experimental results confirmed that the encapsulation, which restricted the moisture that penetrated into the devices. This method is ideally suited to the fabrication of flexible OLEDs.
| Original language | English |
|---|---|
| Pages (from-to) | 1258-1260 |
| Number of pages | 3 |
| Journal | Digest of Technical Papers - SID International Symposium |
| Volume | 43 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - 2012 Jan 1 |
| Event | 49th SID International Symposium, Seminar and Exhibition, dubbed Display Week, 2012 - Boston, United States Duration: 2012 Jun 3 → 2012 Jun 8 |
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ASJC Scopus subject areas
- Engineering(all)
Cite this
Contact printing technologies for encapsulation of flexible oleds. / Kim, Hakkoo; Choi, Jin Hwan; Park, Young Wook; Park, Tae Hyun; Song, Eun Ho; Shin, Se Joong; Lee, Hyun Jun; Ju, Byeong Kwon.
In: Digest of Technical Papers - SID International Symposium, Vol. 43, No. 1, 01.01.2012, p. 1258-1260.Research output: Contribution to journal › Conference article
}
TY - JOUR
T1 - Contact printing technologies for encapsulation of flexible oleds
AU - Kim, Hakkoo
AU - Choi, Jin Hwan
AU - Park, Young Wook
AU - Park, Tae Hyun
AU - Song, Eun Ho
AU - Shin, Se Joong
AU - Lee, Hyun Jun
AU - Ju, Byeong Kwon
PY - 2012/1/1
Y1 - 2012/1/1
N2 - Contact printing is an encapsulation technique, which allows printing of UV-cured resin coated on a polymer stamp (polydimethylsiloxane, which is also known as PDMS) to different surfaces. The contact printing process allows encapsulation to be layered without using sophisticated methods and solvent effect [1]. In this paper, we present the fabrication of a new encapsulation for the flexible organic light-emitting diodes (OLESs) on a plastic substrate. Our experimental results confirmed that the encapsulation, which restricted the moisture that penetrated into the devices. This method is ideally suited to the fabrication of flexible OLEDs.
AB - Contact printing is an encapsulation technique, which allows printing of UV-cured resin coated on a polymer stamp (polydimethylsiloxane, which is also known as PDMS) to different surfaces. The contact printing process allows encapsulation to be layered without using sophisticated methods and solvent effect [1]. In this paper, we present the fabrication of a new encapsulation for the flexible organic light-emitting diodes (OLESs) on a plastic substrate. Our experimental results confirmed that the encapsulation, which restricted the moisture that penetrated into the devices. This method is ideally suited to the fabrication of flexible OLEDs.
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UR - http://www.scopus.com/inward/citedby.url?scp=85075647065&partnerID=8YFLogxK
U2 - 10.1002/j.2168-0159.2012.tb06027.x
DO - 10.1002/j.2168-0159.2012.tb06027.x
M3 - Conference article
AN - SCOPUS:85075647065
VL - 43
SP - 1258
EP - 1260
JO - Digest of Technical Papers - SID International Symposium
JF - Digest of Technical Papers - SID International Symposium
SN - 0097-966X
IS - 1
ER -