Abstract
The contour evolution and sliding behavior of molten Sn-3.0 wt.%Ag-0.5 wt.%Cu on tilting Cu and Al2O3 substrates were investigated. Experiments were performed to determine how the upper and lower contact angles and the sliding behavior changed with tilted angle of surface, kind of substrates and temperature. When the molten drop, as a whole, slid down the tilting solid surface, the upper and lower contact angles measured were defined as the advancing angle and receding angle, respectively. In general, the contour evolution of sample on Cu substrate experienced three periods and each period had different steps with the increase of the temperature compared to the only two periods on Al2O3, which could explain articulately the spreading and wetting behavior for sample on tilting Cu substrate. The reactive layer near receding contact point was thicker than that near advancing contact point as the molten drop slid, because that the former had longer contact time with substrate than the latter. The sliding behavior on Al2O3 was not the same as that on Cu accompanied which the base profile deformed.
| Original language | English |
|---|---|
| Pages (from-to) | 1-5 |
| Number of pages | 5 |
| Journal | Colloids and Surfaces A: Physicochemical and Engineering Aspects |
| Volume | 359 |
| Issue number | 1-3 |
| DOIs | |
| Publication status | Published - 2010 Apr 20 |
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Keywords
- Contact angle
- Contour evolution
- Interaction
- Sliding behavior
- Tilting substrate
ASJC Scopus subject areas
- Colloid and Surface Chemistry
Cite this
Contour evolution and sliding behavior of molten Sn-Ag-Cu on tilting Cu and Al2O3 substrates. / Xu, Hongyan; Yuan, Zhangfu; Lee, Joonho; Matsuura, Hiroyuki; Tsukihashi, Fumitaka.
In: Colloids and Surfaces A: Physicochemical and Engineering Aspects, Vol. 359, No. 1-3, 20.04.2010, p. 1-5.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Contour evolution and sliding behavior of molten Sn-Ag-Cu on tilting Cu and Al2O3 substrates
AU - Xu, Hongyan
AU - Yuan, Zhangfu
AU - Lee, Joonho
AU - Matsuura, Hiroyuki
AU - Tsukihashi, Fumitaka
PY - 2010/4/20
Y1 - 2010/4/20
N2 - The contour evolution and sliding behavior of molten Sn-3.0 wt.%Ag-0.5 wt.%Cu on tilting Cu and Al2O3 substrates were investigated. Experiments were performed to determine how the upper and lower contact angles and the sliding behavior changed with tilted angle of surface, kind of substrates and temperature. When the molten drop, as a whole, slid down the tilting solid surface, the upper and lower contact angles measured were defined as the advancing angle and receding angle, respectively. In general, the contour evolution of sample on Cu substrate experienced three periods and each period had different steps with the increase of the temperature compared to the only two periods on Al2O3, which could explain articulately the spreading and wetting behavior for sample on tilting Cu substrate. The reactive layer near receding contact point was thicker than that near advancing contact point as the molten drop slid, because that the former had longer contact time with substrate than the latter. The sliding behavior on Al2O3 was not the same as that on Cu accompanied which the base profile deformed.
AB - The contour evolution and sliding behavior of molten Sn-3.0 wt.%Ag-0.5 wt.%Cu on tilting Cu and Al2O3 substrates were investigated. Experiments were performed to determine how the upper and lower contact angles and the sliding behavior changed with tilted angle of surface, kind of substrates and temperature. When the molten drop, as a whole, slid down the tilting solid surface, the upper and lower contact angles measured were defined as the advancing angle and receding angle, respectively. In general, the contour evolution of sample on Cu substrate experienced three periods and each period had different steps with the increase of the temperature compared to the only two periods on Al2O3, which could explain articulately the spreading and wetting behavior for sample on tilting Cu substrate. The reactive layer near receding contact point was thicker than that near advancing contact point as the molten drop slid, because that the former had longer contact time with substrate than the latter. The sliding behavior on Al2O3 was not the same as that on Cu accompanied which the base profile deformed.
KW - Contact angle
KW - Contour evolution
KW - Interaction
KW - Sliding behavior
KW - Tilting substrate
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UR - http://www.scopus.com/inward/citedby.url?scp=77549084079&partnerID=8YFLogxK
U2 - 10.1016/j.colsurfa.2010.01.060
DO - 10.1016/j.colsurfa.2010.01.060
M3 - Article
VL - 359
SP - 1
EP - 5
JO - Colloids and Surfaces A: Physicochemical and Engineering Aspects
JF - Colloids and Surfaces A: Physicochemical and Engineering Aspects
SN - 0927-7757
IS - 1-3
ER -