Contour evolution and sliding behavior of molten Sn-Ag-Cu on tilting Cu and Al2O3 substrates

Hongyan Xu, Zhangfu Yuan, Joonho Lee, Hiroyuki Matsuura, Fumitaka Tsukihashi

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10 Citations (Scopus)


The contour evolution and sliding behavior of molten Sn-3.0 wt.%Ag-0.5 wt.%Cu on tilting Cu and Al2O3 substrates were investigated. Experiments were performed to determine how the upper and lower contact angles and the sliding behavior changed with tilted angle of surface, kind of substrates and temperature. When the molten drop, as a whole, slid down the tilting solid surface, the upper and lower contact angles measured were defined as the advancing angle and receding angle, respectively. In general, the contour evolution of sample on Cu substrate experienced three periods and each period had different steps with the increase of the temperature compared to the only two periods on Al2O3, which could explain articulately the spreading and wetting behavior for sample on tilting Cu substrate. The reactive layer near receding contact point was thicker than that near advancing contact point as the molten drop slid, because that the former had longer contact time with substrate than the latter. The sliding behavior on Al2O3 was not the same as that on Cu accompanied which the base profile deformed.

Original languageEnglish
Pages (from-to)1-5
Number of pages5
JournalColloids and Surfaces A: Physicochemical and Engineering Aspects
Issue number1-3
Publication statusPublished - 2010 Apr 20



  • Contact angle
  • Contour evolution
  • Interaction
  • Sliding behavior
  • Tilting substrate

ASJC Scopus subject areas

  • Colloid and Surface Chemistry

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