Creep behaviour of composite lead-free electronic solder joints

F. Guo, Jae-chul Lee, K. N. Subramanian

Research output: Contribution to journalArticle

18 Citations (Scopus)

Abstract

In an attempt to improve service life of lead-free Sn-based electronic solder joints, compatible reinforcements were introduced by in-situ and mechanical mixing methods. The reinforcements affect the steady-state creep rate and the strain for the onset of tertiary creep of the solder joints. However, neither of these parameters, when considered alone, can be used for evaluating the reliability of solder joints. The Larson-Miller parameter, and a new parameter proposed in the paper, can incorporate test parameters to arrive at a reliability prediction methodology. The role of these reinforcements in homogenising creep strain within the joint is analysed. The observed creep behaviour of these composite solders is discussed on the basis of interfacial bonding strength between the reinforcement and the solder matrix.

Original languageEnglish
Pages (from-to)39-42
Number of pages4
JournalSoldering and Surface Mount Technology
Volume15
Issue number1
DOIs
Publication statusPublished - 2003
Externally publishedYes

Fingerprint

solders
Soldering alloys
Creep
reinforcement
Lead
Reinforcement
composite materials
Composite materials
electronics
steady state creep
service life
homogenizing
Service life
methodology
matrices
predictions

Keywords

  • Composite solders
  • Lead-free soldering

ASJC Scopus subject areas

  • Materials Science(all)
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Creep behaviour of composite lead-free electronic solder joints. / Guo, F.; Lee, Jae-chul; Subramanian, K. N.

In: Soldering and Surface Mount Technology, Vol. 15, No. 1, 2003, p. 39-42.

Research output: Contribution to journalArticle

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