Cure kinetic model of biphenyl-type epoxy/phenol novolac resin system considering active complex formation

Ho Gyu Yoon, Seung Han, Whan Gun Kim, Kwang Suck Suh

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3 Citations (Scopus)


The investigation of cure kinetics of biphenyl-type epoxy (4,4-diglycidyloxy-3,3, 5,5-tetramethyl biphenyl)/phenol novolac resin system with triphenylphosphine catalyst was performed by differential scanning calorimeter using an isothermal approach. The cure reaction of the system could be explained by considering the formation of epoxy-phenol-catalyst trimolecular active complex and effectively described by combining autocatalytic and nth order model. To describe the cure reaction in the latter stage, a diffusion factor has been used. By combining the proposed kinetic model with a diffusion factor, it is possible to predict the cure kinetics over the whole range of conversion.

Original languageEnglish
Pages (from-to)507-516
Number of pages10
JournalPolymer (Korea)
Issue number4
Publication statusPublished - 1999 Dec 1



  • Active complex
  • Biphenyl epoxy/phenol novolac resin
  • Cure kinetics
  • Diffusion factor

ASJC Scopus subject areas

  • Polymers and Plastics
  • Materials Chemistry

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