Cure kinetics of biphenyl epoxy resin system using latent catalysts

W. G. Kim, H. G. Yoon, J. Y. Lee

Research output: Contribution to journalArticle

29 Citations (Scopus)

Abstract

The investigation of the cure kinetics of a biphenyl epoxy-phenol resin system with different kinds of latent catalysts was performed by differential scanning calorimetry using an isothermal approach. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicated that the curing reaction of the biphenyl epoxy resin system in this experiment proceeded through an autocatalytic kinetic mechanism, irrespective of the kind of catalyst. The epoxy resin system with acid/diazabicycloundecene (DBU) salt as the latent catalyst showed a second overall reaction order; however, a third reaction order was represented for microencapsulated triphenylphosphine (TPP). The storage stability tests for these systems were performed, and a good shelf life was observed in the epoxy resin system with pyromellitic acid/DBU salt, trimellitic acid/DBU salt, and microencapsulated TPP as the latent catalyst.

Original languageEnglish
Pages (from-to)2711-2720
Number of pages10
JournalJournal of Applied Polymer Science
Volume81
Issue number11
DOIs
Publication statusPublished - 2001 Sep 12

Keywords

  • Biphenyl epoxy resin
  • Cure kinetics
  • Latent catalyst
  • Phenol resin
  • Shelf life

ASJC Scopus subject areas

  • Chemistry(all)
  • Surfaces, Coatings and Films
  • Polymers and Plastics
  • Materials Chemistry

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