Curing reaction of biphenyl epoxy resin with different phenolic functional hardeners

Seung Han, Whan Gun Kim, Ho Gyu Yoon, Tak Jin Moon

Research output: Contribution to journalArticle

67 Citations (Scopus)

Abstract

The investigation of cure kinetics and relationships between glass transition temperature and conversion of biphenyl epoxy resin (4,4′-diglycidyloxy-3,3′,5,5′-tetramethyl biphenyl) with different phenolic hardeners was performed by differential scanning calorimeter using an isothermal approach over the temperature range 120-150°C. All kinetic parameters of the curing reaction including the reaction order, activation energy, and rate constant were calculated and reported. The results indicate that the curing reaction of formulations using xylok and dicyclopentadiene type phenolic resins (DCPDP) as hardeners proceeds through a first-order kinetic mechanism, whereas the curing reaction of formulations using phenol novolac as a hardener goes through an autocatalytic kinetic mechanism. The differences of curing reaction with the change of hardener in biphenyl epoxy resin systems were explained with the relationships between Tg and reaction conversion using the DiBenedetto equation. A detailed cure mechanism in biphenyl-type epoxy resin with the different hardeners has been suggested.

Original languageEnglish
Pages (from-to)773-783
Number of pages11
JournalJournal of Polymer Science, Part A: Polymer Chemistry
Volume36
Issue number5
DOIs
Publication statusPublished - 1998 Apr 15

Keywords

  • Biphenyl epoxy
  • Cure kinetics
  • Cure mechanism
  • Hardener

ASJC Scopus subject areas

  • Polymers and Plastics
  • Organic Chemistry
  • Materials Chemistry

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