Decomposition of Cu6Sn5 particles in solder for the growth of a ternary (Cu1-xNix)6Sn5 layer on a ni substrate

Bo Mook Chung, Kyoung Kook Hong, Joo Youl Huh

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

The interaction between Cu6Sn5 particles in the bulk of a solder and a Ni substrate was examined during solid-state aging using Cu/Sn/Ni and Cu/Sn/Cu/Sn/Ni diffusion couples with initially thin Cu layers. The results clearly demonstrated that the (Cu,Ni)6Sn5 particles dispersed in the bulk solder decomposed in order for a ternary (Cu1-xNix)6Sn5 layer to grow at the solder/Ni interface during solid-state aging. The interaction between the (Cu,Ni)6Sn5 particles and the (Cu1-xNi x)6Sn5 layer occurs owing to the driving force for the (Cu,Ni)6Sn5 compound to become saturated with Ni. A (Ni,Cu)3Sn4 layer forms at the (Cu1-xNi x)6Sn5/Ni interface only after the Ni composition of the (Cu,Ni)6Sn5 phase in the bulk solder approaches that of the (Cu1-xNix)6Sn 5 layer. Once the (Ni,Cu)3Sn4 layer has formed, it grows at an exceptionally rapid rate by consuming the (Cu 1-xNix)6Sn5 and Sn layers, which can be problematic in solder joint reliability.

Original languageEnglish
Pages (from-to)487-492
Number of pages6
JournalMetals and Materials International
Volume15
Issue number3
DOIs
Publication statusPublished - 2009 Jun

Keywords

  • Cross-interaction
  • Cu/Sn/Ni diffusion couple
  • Decomposition
  • Leadfree solder
  • Ternary intermetallic compounds

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys
  • Materials Chemistry

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