Decomposition of Cu6Sn5 particles in solder for the growth of a ternary (Cu1-xNix)6Sn5 layer on a ni substrate

Bo Mook Chung, Kyoung Kook Hong, Joo Youl Huh

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

The interaction between Cu6Sn5 particles in the bulk of a solder and a Ni substrate was examined during solid-state aging using Cu/Sn/Ni and Cu/Sn/Cu/Sn/Ni diffusion couples with initially thin Cu layers. The results clearly demonstrated that the (Cu,Ni)6Sn5 particles dispersed in the bulk solder decomposed in order for a ternary (Cu1-xNix)6Sn5 layer to grow at the solder/Ni interface during solid-state aging. The interaction between the (Cu,Ni)6Sn5 particles and the (Cu1-xNi x)6Sn5 layer occurs owing to the driving force for the (Cu,Ni)6Sn5 compound to become saturated with Ni. A (Ni,Cu)3Sn4 layer forms at the (Cu1-xNi x)6Sn5/Ni interface only after the Ni composition of the (Cu,Ni)6Sn5 phase in the bulk solder approaches that of the (Cu1-xNix)6Sn 5 layer. Once the (Ni,Cu)3Sn4 layer has formed, it grows at an exceptionally rapid rate by consuming the (Cu 1-xNix)6Sn5 and Sn layers, which can be problematic in solder joint reliability.

Original languageEnglish
Pages (from-to)487-492
Number of pages6
JournalMetals and Materials International
Volume15
Issue number3
DOIs
Publication statusPublished - 2009 Jun 1

Fingerprint

solders
Soldering alloys
Decomposition
decomposition
Substrates
Aging of materials
solid state
interactions
Chemical analysis

Keywords

  • Cross-interaction
  • Cu/Sn/Ni diffusion couple
  • Decomposition
  • Leadfree solder
  • Ternary intermetallic compounds

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Metals and Alloys
  • Mechanics of Materials
  • Materials Chemistry

Cite this

Decomposition of Cu6Sn5 particles in solder for the growth of a ternary (Cu1-xNix)6Sn5 layer on a ni substrate. / Chung, Bo Mook; Hong, Kyoung Kook; Huh, Joo Youl.

In: Metals and Materials International, Vol. 15, No. 3, 01.06.2009, p. 487-492.

Research output: Contribution to journalArticle

@article{4104f9cdf604437ab1f59a8d5c535262,
title = "Decomposition of Cu6Sn5 particles in solder for the growth of a ternary (Cu1-xNix)6Sn5 layer on a ni substrate",
abstract = "The interaction between Cu6Sn5 particles in the bulk of a solder and a Ni substrate was examined during solid-state aging using Cu/Sn/Ni and Cu/Sn/Cu/Sn/Ni diffusion couples with initially thin Cu layers. The results clearly demonstrated that the (Cu,Ni)6Sn5 particles dispersed in the bulk solder decomposed in order for a ternary (Cu1-xNix)6Sn5 layer to grow at the solder/Ni interface during solid-state aging. The interaction between the (Cu,Ni)6Sn5 particles and the (Cu1-xNi x)6Sn5 layer occurs owing to the driving force for the (Cu,Ni)6Sn5 compound to become saturated with Ni. A (Ni,Cu)3Sn4 layer forms at the (Cu1-xNi x)6Sn5/Ni interface only after the Ni composition of the (Cu,Ni)6Sn5 phase in the bulk solder approaches that of the (Cu1-xNix)6Sn 5 layer. Once the (Ni,Cu)3Sn4 layer has formed, it grows at an exceptionally rapid rate by consuming the (Cu 1-xNix)6Sn5 and Sn layers, which can be problematic in solder joint reliability.",
keywords = "Cross-interaction, Cu/Sn/Ni diffusion couple, Decomposition, Leadfree solder, Ternary intermetallic compounds",
author = "Chung, {Bo Mook} and Hong, {Kyoung Kook} and Huh, {Joo Youl}",
year = "2009",
month = "6",
day = "1",
doi = "10.1007/s12540-009-0487-8",
language = "English",
volume = "15",
pages = "487--492",
journal = "Metals and Materials International",
issn = "1598-9623",
publisher = "Korean Institute of Metals and Materials",
number = "3",

}

TY - JOUR

T1 - Decomposition of Cu6Sn5 particles in solder for the growth of a ternary (Cu1-xNix)6Sn5 layer on a ni substrate

AU - Chung, Bo Mook

AU - Hong, Kyoung Kook

AU - Huh, Joo Youl

PY - 2009/6/1

Y1 - 2009/6/1

N2 - The interaction between Cu6Sn5 particles in the bulk of a solder and a Ni substrate was examined during solid-state aging using Cu/Sn/Ni and Cu/Sn/Cu/Sn/Ni diffusion couples with initially thin Cu layers. The results clearly demonstrated that the (Cu,Ni)6Sn5 particles dispersed in the bulk solder decomposed in order for a ternary (Cu1-xNix)6Sn5 layer to grow at the solder/Ni interface during solid-state aging. The interaction between the (Cu,Ni)6Sn5 particles and the (Cu1-xNi x)6Sn5 layer occurs owing to the driving force for the (Cu,Ni)6Sn5 compound to become saturated with Ni. A (Ni,Cu)3Sn4 layer forms at the (Cu1-xNi x)6Sn5/Ni interface only after the Ni composition of the (Cu,Ni)6Sn5 phase in the bulk solder approaches that of the (Cu1-xNix)6Sn 5 layer. Once the (Ni,Cu)3Sn4 layer has formed, it grows at an exceptionally rapid rate by consuming the (Cu 1-xNix)6Sn5 and Sn layers, which can be problematic in solder joint reliability.

AB - The interaction between Cu6Sn5 particles in the bulk of a solder and a Ni substrate was examined during solid-state aging using Cu/Sn/Ni and Cu/Sn/Cu/Sn/Ni diffusion couples with initially thin Cu layers. The results clearly demonstrated that the (Cu,Ni)6Sn5 particles dispersed in the bulk solder decomposed in order for a ternary (Cu1-xNix)6Sn5 layer to grow at the solder/Ni interface during solid-state aging. The interaction between the (Cu,Ni)6Sn5 particles and the (Cu1-xNi x)6Sn5 layer occurs owing to the driving force for the (Cu,Ni)6Sn5 compound to become saturated with Ni. A (Ni,Cu)3Sn4 layer forms at the (Cu1-xNi x)6Sn5/Ni interface only after the Ni composition of the (Cu,Ni)6Sn5 phase in the bulk solder approaches that of the (Cu1-xNix)6Sn 5 layer. Once the (Ni,Cu)3Sn4 layer has formed, it grows at an exceptionally rapid rate by consuming the (Cu 1-xNix)6Sn5 and Sn layers, which can be problematic in solder joint reliability.

KW - Cross-interaction

KW - Cu/Sn/Ni diffusion couple

KW - Decomposition

KW - Leadfree solder

KW - Ternary intermetallic compounds

UR - http://www.scopus.com/inward/record.url?scp=77955168428&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=77955168428&partnerID=8YFLogxK

U2 - 10.1007/s12540-009-0487-8

DO - 10.1007/s12540-009-0487-8

M3 - Article

AN - SCOPUS:77955168428

VL - 15

SP - 487

EP - 492

JO - Metals and Materials International

JF - Metals and Materials International

SN - 1598-9623

IS - 3

ER -