Design and batch-fabrication of diamond thermocouple probes for the quantitative thermopower profiling of silicon IC devices

Byeonghee Lee, Kyeongtae Kim, Seungkoo Lee, Ohmyoung Kwon, Jong Hoon Kim, Dae Soon Lim, Woo Il Lee, Joon Sik Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We developed a measurement technique that can quantitatively map out the dopant density profile of a silicon integrated-circuit device. This method obtains the quantitative doping density profile by simultaneously carrying out local heating, temperature sensing, and thermoelectric voltage measurement at the tip of a diamond thermocouple probe. This probe, which is the key component of the proposed scheme, is fabricated through a nano-fabrication technique that makes use of boron-doped diamond film that can resist stress up to 10 Gpa, which is necessary for stable electric contact with silicon samples. The tip and cantilever of the probe are made of B-doped diamond by means of the silicon lost-mold technique that guarantees a sharper tip apex than that of a diamond-coated probe. A gold-chromium thermocouple junction is integrated at the tip apex for simultaneous heating and sensing. The size of the thermocouple is about 500 nm and the radius of the tip apex is less than 50 nm. The measurement technique is demonstrated by measuring the thermopower distribution across a silicon p-n junction and the result is compared with the theoretical values.

Original languageEnglish
Title of host publication2010 14th International Heat Transfer Conference, IHTC 14
Pages559-563
Number of pages5
DOIs
Publication statusPublished - 2010
Event2010 14th International Heat Transfer Conference, IHTC 14 - Washington, DC, United States
Duration: 2010 Aug 82010 Aug 13

Publication series

Name2010 14th International Heat Transfer Conference, IHTC 14
Volume6

Other

Other2010 14th International Heat Transfer Conference, IHTC 14
CountryUnited States
CityWashington, DC
Period10/8/810/8/13

Keywords

  • Diamond thermoelectric probe
  • Dopant density profile
  • Silicon p-n junction
  • Thermopower

ASJC Scopus subject areas

  • Fluid Flow and Transfer Processes

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    Lee, B., Kim, K., Lee, S., Kwon, O., Kim, J. H., Lim, D. S., Lee, W. I., & Lee, J. S. (2010). Design and batch-fabrication of diamond thermocouple probes for the quantitative thermopower profiling of silicon IC devices. In 2010 14th International Heat Transfer Conference, IHTC 14 (pp. 559-563). (2010 14th International Heat Transfer Conference, IHTC 14; Vol. 6). https://doi.org/10.1115/IHTC14-23347