Design and batch fabrication of probes for sub-100 nm scanning thermal microscopy

L. Shi, Oh Myoung Kwon, A. C. Miner, A. Majumdar

Research output: Contribution to journalArticle

98 Citations (Scopus)

Abstract

A batch fabrication process has been developed for making cantilever probes for scanning thermal microscopy (SThM) with spatial resolution in the sub-100 nm range. A heat transfer model was developed to optimize the thermal design of the probes. Low thermal conductivity silicon dioxide and silicon nitride were chosen for fabricating the probe tips and cantilevers, respectively, in order to minimize heat loss from the sample to the probe and to improve temperature measurement accuracy and spatial resolution. An etch process was developed for making silicon dioxide tips with tip radius as small as 20 nm. A thin film thermocouple junction was fabricated at the tip end with a junction height that could be controlled in the range of 100-600 nm. These thermal probes have been used extensively for thermal imaging of micro- and nano-electronic devices with a spatial resolution of 50 nm. This paper presents measurement results of the steady state and dynamic temperature responses of the thermal probes and examines the wear characteristics of the probes.

Original languageEnglish
Pages (from-to)370-378
Number of pages9
JournalJournal of Microelectromechanical Systems
Volume10
Issue number3
DOIs
Publication statusPublished - 2001 Sep 1
Externally publishedYes

Fingerprint

Microscopic examination
Scanning
Fabrication
Silica
Nanoelectronics
Infrared imaging
Thermocouples
Hot Temperature
Silicon nitride
Heat losses
Microelectronics
Temperature measurement
Thermal conductivity
Wear of materials
Heat transfer
Thin films
Temperature

Keywords

  • Batch fabrication
  • Cantilever probes
  • Scanning thermal microscopy
  • Thermal design

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

Design and batch fabrication of probes for sub-100 nm scanning thermal microscopy. / Shi, L.; Kwon, Oh Myoung; Miner, A. C.; Majumdar, A.

In: Journal of Microelectromechanical Systems, Vol. 10, No. 3, 01.09.2001, p. 370-378.

Research output: Contribution to journalArticle

@article{ddfb34ea315e45e0900d81c5b33b8caa,
title = "Design and batch fabrication of probes for sub-100 nm scanning thermal microscopy",
abstract = "A batch fabrication process has been developed for making cantilever probes for scanning thermal microscopy (SThM) with spatial resolution in the sub-100 nm range. A heat transfer model was developed to optimize the thermal design of the probes. Low thermal conductivity silicon dioxide and silicon nitride were chosen for fabricating the probe tips and cantilevers, respectively, in order to minimize heat loss from the sample to the probe and to improve temperature measurement accuracy and spatial resolution. An etch process was developed for making silicon dioxide tips with tip radius as small as 20 nm. A thin film thermocouple junction was fabricated at the tip end with a junction height that could be controlled in the range of 100-600 nm. These thermal probes have been used extensively for thermal imaging of micro- and nano-electronic devices with a spatial resolution of 50 nm. This paper presents measurement results of the steady state and dynamic temperature responses of the thermal probes and examines the wear characteristics of the probes.",
keywords = "Batch fabrication, Cantilever probes, Scanning thermal microscopy, Thermal design",
author = "L. Shi and Kwon, {Oh Myoung} and Miner, {A. C.} and A. Majumdar",
year = "2001",
month = "9",
day = "1",
doi = "10.1109/84.946785",
language = "English",
volume = "10",
pages = "370--378",
journal = "Journal of Microelectromechanical Systems",
issn = "1057-7157",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
number = "3",

}

TY - JOUR

T1 - Design and batch fabrication of probes for sub-100 nm scanning thermal microscopy

AU - Shi, L.

AU - Kwon, Oh Myoung

AU - Miner, A. C.

AU - Majumdar, A.

PY - 2001/9/1

Y1 - 2001/9/1

N2 - A batch fabrication process has been developed for making cantilever probes for scanning thermal microscopy (SThM) with spatial resolution in the sub-100 nm range. A heat transfer model was developed to optimize the thermal design of the probes. Low thermal conductivity silicon dioxide and silicon nitride were chosen for fabricating the probe tips and cantilevers, respectively, in order to minimize heat loss from the sample to the probe and to improve temperature measurement accuracy and spatial resolution. An etch process was developed for making silicon dioxide tips with tip radius as small as 20 nm. A thin film thermocouple junction was fabricated at the tip end with a junction height that could be controlled in the range of 100-600 nm. These thermal probes have been used extensively for thermal imaging of micro- and nano-electronic devices with a spatial resolution of 50 nm. This paper presents measurement results of the steady state and dynamic temperature responses of the thermal probes and examines the wear characteristics of the probes.

AB - A batch fabrication process has been developed for making cantilever probes for scanning thermal microscopy (SThM) with spatial resolution in the sub-100 nm range. A heat transfer model was developed to optimize the thermal design of the probes. Low thermal conductivity silicon dioxide and silicon nitride were chosen for fabricating the probe tips and cantilevers, respectively, in order to minimize heat loss from the sample to the probe and to improve temperature measurement accuracy and spatial resolution. An etch process was developed for making silicon dioxide tips with tip radius as small as 20 nm. A thin film thermocouple junction was fabricated at the tip end with a junction height that could be controlled in the range of 100-600 nm. These thermal probes have been used extensively for thermal imaging of micro- and nano-electronic devices with a spatial resolution of 50 nm. This paper presents measurement results of the steady state and dynamic temperature responses of the thermal probes and examines the wear characteristics of the probes.

KW - Batch fabrication

KW - Cantilever probes

KW - Scanning thermal microscopy

KW - Thermal design

UR - http://www.scopus.com/inward/record.url?scp=0035440479&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0035440479&partnerID=8YFLogxK

U2 - 10.1109/84.946785

DO - 10.1109/84.946785

M3 - Article

AN - SCOPUS:0035440479

VL - 10

SP - 370

EP - 378

JO - Journal of Microelectromechanical Systems

JF - Journal of Microelectromechanical Systems

SN - 1057-7157

IS - 3

ER -