Determination of viscoelastic properties of thin pressure sensitive adhesive using dynamic mechanical analysis

H. Jung, H. Song, M. Lee, Yun-Jae Kim, S. Youn, K. Lee, J. Shin, M. Kim

Research output: Contribution to journalArticle

Abstract

This paper suggests a testing method to measure the frequency-domain viscoelastic properties of a micron-scale thickness adhesive. To test a thin adhesive below room temperature, a new double-shear tester is designed in this study. A thin pressure-sensitive adhesive (KGK-200A50) with the thickness of 50 μm is tested in the range of −5.5∘C–16.4∘C and 0.1 Hz–5 Hz. The measured storage and loss modulus are found to vary between 15 kPa–226 kPa and 31 kPa–301 kPa, respectively, and over the full range of frequency and temperature investigated. A time–temperature superposition is applied to derive higher-frequency viscoelastic properties with the extended frequency range of 0.1 Hz–2000 Hz at 16.4∘C. The experimental results are found to be overall in good agreement with other published results.

Original languageEnglish
JournalMechanics of Time-Dependent Materials
DOIs
Publication statusPublished - 2019 Jan 1

Keywords

  • Dynamic mechanical analysis
  • Pressure-sensitive adhesive
  • Thin adhesive
  • Time–temperature superposition
  • Viscoelastic property

ASJC Scopus subject areas

  • Chemical Engineering(all)
  • Materials Science(all)
  • Aerospace Engineering
  • Mechanical Engineering

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